10AX066H3F34E2SG
Интель
- Lifecycle
- Active
- Stock
- 7604 ПКС
- Package
- FBGA-1152
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Это подробное сравнение 10AX066H3F34E2SG и 10AX032E2F29E2SG предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.
Replacement verdict
The 10AX066H3F34E2SG and 10AX032E2F29E2SG are both Intel Arria 10 GX series FPGAs sharing the same core architecture, transceiver technology, and logic cell family, making them functionally related candidates. However, they differ significantly in logic density, package footprint, and speed grade, so the 10AX032E2F29E2SG cannot serve as a direct drop-in replacement for the 10AX066H3F34E2SG without design rework. The lower-density device may be suitable only where reduced logic resources and a smaller package are acceptable, and full validation against the target design's resource, I/O, and timing requirements is required before substitution.
Интель
Интель
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10AX066H3F34E2SG | 10AX032E2F29E2SG | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 660,000 | 320,000 | Logic capacity determines the maximum complexity of the digital design that can be implemented; a device with fewer LEs cannot host a design that requires more logic resources. |
| Adaptive Logic Modules (ALM) | 251,680 | 122,080 | ALMs are the fundamental building blocks of the FPGA fabric; the count directly bounds the amount of combinational and sequential logic available. |
| Total Embedded Memory | 42,620 Kbit | 19,760 Kbit | On-chip memory capacity affects buffering, FIFO depth, and data storage within the FPGA; insufficient memory forces external memory usage or design changes. |
| DSP Blocks (Variable Precision) | 1,688 | 984 | DSP blocks accelerate multiply-accumulate operations; the count limits the number of parallel arithmetic operations such as filtering or FFT stages. |
| Maximum User I/O Pins | 492 | 360 | I/O count determines how many external signals and peripherals can be interfaced; fewer pins may prevent a drop-in replacement in I/O-heavy designs. |
| Package | FBGA-1152 | FBGA-780 | Package footprint and ball count must match the PCB layout; a different package is not physically interchangeable without a board redesign. |
| Transceiver Count | 24 | 12 | High-speed serial transceivers support protocols such as PCIe and Ethernet; fewer transceivers restrict the number of high-speed links the device can support. |
| Speed Grade | 3 (High Performance) | 2 (Standard Performance) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same clock frequency requirements. |
| Operating Temperature Range | 0°C to 100°C (Commercial) | 0°C to 100°C (Commercial) | Temperature range must cover the application environment; industrial or automotive ranges are required for harsh environments. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10AX066H3F34E2SG | 10AX032E2F29E2SG |
|---|---|---|
| Supplier | - | Intel |
| Series | Arria 10 GX | Arria 10 GX |
| Part Status | Active | Active |
| Number of LABs/CLBs | 250540 | 119900 |
| Number of Logic Elements/Cells | 660000 | 320000 |
| Total RAM Bits | 49610752 | 21040128 |
| Number of I/O | 492 | 360 |
| Voltage - Supply | 0.87V ~ 0.93V | 0.87V ~ 0.98V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) | 0°C ~ 100°C (TJ) |
The 10AX066H3F34E2SG offers approximately 660,000 logic elements (LEs) in a 1152-pin FBGA package (F34), while the 10AX032E2F29E2SG provides approximately 320,000 LEs in a 780-pin FBGA package (F29). The 10AX066H3F34E2SG also features a higher transceiver count and more embedded memory compared to the 10AX032E2F29E2SG. Both are Intel Arria 10 GX devices with integrated transceivers, but they differ in logic density, package size, and I/O count.
No. The 10AX066H3F34E2SG uses a 1152-ball FBGA package (F34), while the 10AX032E2F29E2SG uses a 780-ball FBGA package (F29). These packages have different ball counts, footprints, and pinouts, so they are not pin-compatible or drop-in replacements for each other.
No. Direct substitution is not possible because the two devices differ in package footprint, logic capacity, transceiver channels, and I/O count. A redesign of the PCB, power delivery, and pin assignment would be required. The 10AX032E2F29E2SG has fewer logic elements and a smaller package, so it cannot accommodate designs that fully utilize the 10AX066H3F34E2SG resources.
Both devices are Intel Arria 10 GX FPGAs with integrated transceivers. The 10AX066H3F34E2SG supports up to 48 transceiver channels at data rates up to 17.4 Gbps (depending on speed grade and configuration). The 10AX032E2F29E2SG supports fewer transceiver channels, typically up to 24 channels, also at rates up to 17.4 Gbps. Exact channel counts should be verified in the respective device pin-out files and datasheets.
Yes. Both devices are Intel Arria 10 FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration details such as bitstream size differ due to different logic densities, but the supported configuration modes are identical across the Arria 10 family.
Both devices are specified for commercial temperature range (0°C to 85°C junction temperature) as indicated by the "E2" speed grade and temperature suffix in their part numbers. Industrial and extended temperature options exist for the Arria 10 family, but these specific ordering codes correspond to commercial temperature operation. Always confirm the exact temperature grade in the manufacturer's ordering information.
Power consumption depends on design utilization, clock frequencies, and transceiver usage. However, the 10AX066H3F34E2SG has a larger logic fabric and more transceivers, so it generally has higher static and dynamic power consumption than the 10AX032E2F29E2SG under similar operating conditions. Intel's Early Power Estimator (EPE) tool should be used to obtain accurate power estimates for each specific design.
Yes. Both devices are offered in RoHS-compliant packages as part of Intel's Arria 10 FPGA family. The "SG" suffix in both part numbers indicates lead-free (Pb-free) packaging. For specific RoHS and REACH compliance documentation, refer to Intel's product material declarations and environmental compliance reports for the Arria 10 device family.