10AX066H3F34E2SG vs 10AX032E2F29E2SG

Это подробное сравнение 10AX066H3F34E2SG и 10AX032E2F29E2SG предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 10AX066H3F34E2SG and 10AX032E2F29E2SG are both Intel Arria 10 GX series FPGAs sharing the same core architecture, transceiver technology, and logic cell family, making them functionally related candidates. However, they differ significantly in logic density, package footprint, and speed grade, so the 10AX032E2F29E2SG cannot serve as a direct drop-in replacement for the 10AX066H3F34E2SG without design rework. The lower-density device may be suitable only where reduced logic resources and a smaller package are acceptable, and full validation against the target design's resource, I/O, and timing requirements is required before substitution.

Logic Density Validation required
Package Type Not compatible
Speed Grade Validation required
Transceiver Capability High match

Parts at a glance

Part A

10AX066H3F34E2SG

Интель

Lifecycle
Active
Stock
7604 ПКС
Package
FBGA-1152
Series
Встроенные - FPGA (Field Programmable Gate Array)
Part B

10AX032E2F29E2SG

Интель

Lifecycle
Active
Stock
9210 ПКС
Package
BBGA-780
Series
Встроенные - FPGA (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 10AX066H3F34E2SG 10AX032E2F29E2SG Why it matters
Logic Elements (LE) 660,000 320,000 Logic capacity determines the maximum complexity of the digital design that can be implemented; a device with fewer LEs cannot host a design that requires more logic resources.
Adaptive Logic Modules (ALM) 251,680 122,080 ALMs are the fundamental building blocks of the FPGA fabric; the count directly bounds the amount of combinational and sequential logic available.
Total Embedded Memory 42,620 Kbit 19,760 Kbit On-chip memory capacity affects buffering, FIFO depth, and data storage within the FPGA; insufficient memory forces external memory usage or design changes.
DSP Blocks (Variable Precision) 1,688 984 DSP blocks accelerate multiply-accumulate operations; the count limits the number of parallel arithmetic operations such as filtering or FFT stages.
Maximum User I/O Pins 492 360 I/O count determines how many external signals and peripherals can be interfaced; fewer pins may prevent a drop-in replacement in I/O-heavy designs.
Package FBGA-1152 FBGA-780 Package footprint and ball count must match the PCB layout; a different package is not physically interchangeable without a board redesign.
Transceiver Count 24 12 High-speed serial transceivers support protocols such as PCIe and Ethernet; fewer transceivers restrict the number of high-speed links the device can support.
Speed Grade 3 (High Performance) 2 (Standard Performance) Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet the same clock frequency requirements.
Operating Temperature Range 0°C to 100°C (Commercial) 0°C to 100°C (Commercial) Temperature range must cover the application environment; industrial or automotive ranges are required for harsh environments.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 10AX066H3F34E2SG 10AX032E2F29E2SG
Supplier - Intel
Series Arria 10 GX Arria 10 GX
Part Status Active Active
Number of LABs/CLBs 250540 119900
Number of Logic Elements/Cells 660000 320000
Total RAM Bits 49610752 21040128
Number of I/O 492 360
Voltage - Supply 0.87V ~ 0.93V 0.87V ~ 0.98V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 100°C (TJ) 0°C ~ 100°C (TJ)

Frequently asked questions

What are the key differences between the Intel Arria 10 10AX066H3F34E2SG and 10AX032E2F29E2SG FPGAs?

The 10AX066H3F34E2SG offers approximately 660,000 logic elements (LEs) in a 1152-pin FBGA package (F34), while the 10AX032E2F29E2SG provides approximately 320,000 LEs in a 780-pin FBGA package (F29). The 10AX066H3F34E2SG also features a higher transceiver count and more embedded memory compared to the 10AX032E2F29E2SG. Both are Intel Arria 10 GX devices with integrated transceivers, but they differ in logic density, package size, and I/O count.

Are the 10AX066H3F34E2SG and 10AX032E2F29E2SG pin-compatible?

No. The 10AX066H3F34E2SG uses a 1152-ball FBGA package (F34), while the 10AX032E2F29E2SG uses a 780-ball FBGA package (F29). These packages have different ball counts, footprints, and pinouts, so they are not pin-compatible or drop-in replacements for each other.

Can the 10AX032E2F29E2SG be used as a direct substitute for the 10AX066H3F34E2SG in an existing design?

No. Direct substitution is not possible because the two devices differ in package footprint, logic capacity, transceiver channels, and I/O count. A redesign of the PCB, power delivery, and pin assignment would be required. The 10AX032E2F29E2SG has fewer logic elements and a smaller package, so it cannot accommodate designs that fully utilize the 10AX066H3F34E2SG resources.

What are the transceiver capabilities of the 10AX066H3F34E2SG and 10AX032E2F29E2SG?

Both devices are Intel Arria 10 GX FPGAs with integrated transceivers. The 10AX066H3F34E2SG supports up to 48 transceiver channels at data rates up to 17.4 Gbps (depending on speed grade and configuration). The 10AX032E2F29E2SG supports fewer transceiver channels, typically up to 24 channels, also at rates up to 17.4 Gbps. Exact channel counts should be verified in the respective device pin-out files and datasheets.

Do the 10AX066H3F34E2SG and 10AX032E2F29E2SG support the same configuration methods?

Yes. Both devices are Intel Arria 10 FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration details such as bitstream size differ due to different logic densities, but the supported configuration modes are identical across the Arria 10 family.

What are the operating temperature ranges for the 10AX066H3F34E2SG and 10AX032E2F29E2SG?

Both devices are specified for commercial temperature range (0°C to 85°C junction temperature) as indicated by the "E2" speed grade and temperature suffix in their part numbers. Industrial and extended temperature options exist for the Arria 10 family, but these specific ordering codes correspond to commercial temperature operation. Always confirm the exact temperature grade in the manufacturer's ordering information.

Which device consumes more power: the 10AX066H3F34E2SG or the 10AX032E2F29E2SG?

Power consumption depends on design utilization, clock frequencies, and transceiver usage. However, the 10AX066H3F34E2SG has a larger logic fabric and more transceivers, so it generally has higher static and dynamic power consumption than the 10AX032E2F29E2SG under similar operating conditions. Intel's Early Power Estimator (EPE) tool should be used to obtain accurate power estimates for each specific design.

Are the 10AX066H3F34E2SG and 10AX032E2F29E2SG RoHS compliant?

Yes. Both devices are offered in RoHS-compliant packages as part of Intel's Arria 10 FPGA family. The "SG" suffix in both part numbers indicates lead-free (Pb-free) packaging. For specific RoHS and REACH compliance documentation, refer to Intel's product material declarations and environmental compliance reports for the Arria 10 device family.