10CL080YF780I7G
Альтера
- Lifecycle
- Active
- Stock
- 4082 ПКС
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Это подробное сравнение 10CL080YF780I7G и 10CL016YF484C8G предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.
Replacement verdict
The 10CL080YF780I7G and 10CL016YF484C8G are both Intel Cyclone 10 LP FPGAs sharing the same core architecture and 1.2 V core supply, but they differ in logic density, package footprint, and temperature grade. The 10CL080YF780I7G offers higher logic capacity and industrial temperature support, while the 10CL016YF484C8G provides a smaller footprint and commercial temperature range. Direct substitution is possible only when logic utilization, I/O count, and thermal requirements are revalidated against the target design.
Альтера
Альтера
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10CL080YF780I7G | 10CL016YF484C8G | Why it matters |
|---|---|---|---|
| Logic Elements (LEs) | 80,000 | 16,000 | Logic capacity determines how much digital logic can be implemented; a large mismatch prevents direct functional substitution. |
| Total RAM Bits | 2,810,880 | 516,096 | Embedded memory capacity affects buffering, FIFO depth, and data storage capability within the design. |
| Number of I/Os | 429 | 340 | Available I/O pins constrain external interfacing; fewer pins may make a design infeasible without rework. |
| Package / Case | 780-FBGA (29x29) | 484-FBGA (23x23) | Package footprint and ball count must match the PCB layout for physical compatibility. |
| Operating Temperature Range | -40°C to 100°C (TJ) | 0°C to 85°C (TJ) | Industrial versus commercial temperature grades determine suitability for harsh or controlled environments. |
| Speed Grade | 7 (Fastest) | 8 (Slowest) | Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet design timing. |
| Supply Voltage | 1.2 V Core | 1.2 V Core | Core voltage must match the board power design; identical values indicate power compatibility. |
| Number of PLLs | 2 | 2 | PLLs provide clock synthesis and management; matching counts support similar clocking architectures. |
| Embedded Multipliers (18x18) | 150 | 56 | DSP blocks are essential for arithmetic-intensive functions; fewer multipliers limit signal processing capability. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10CL080YF780I7G | 10CL016YF484C8G |
|---|---|---|
| Series | Cyclone® 10 LP | Cyclone® 10 LP |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | Not Verified |
| Number of Logic Elements / Cells | 81264 | 15408 |
| Total RAM Bits | 2810880 | 516096 |
| Number of I/O | 423 | 340 |
| Voltage - Supply | 1.2V | 1.2V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
| Number of LA Bs / CL Bs | 5079 | 963 |
| Packaging | Tray | - |
The 10CL080YF780I7G is an Intel (Altera) Cyclone 10 LP FPGA with 80,000 logic elements in a 780-pin FBGA package, rated for industrial temperature range (I7 speed grade). The 10CL016YF484C8G is a Cyclone 10 LP FPGA with 16,000 logic elements in a 484-pin FBGA package, rated for commercial temperature range (C8 speed grade). They differ in logic density, package size, pin count, and temperature/speed grade.
No. The 10CL080YF780I7G uses a 780-pin FBGA package, while the 10CL016YF484C8G uses a 484-pin FBGA package. Different pin counts and package footprints mean they are not pin-to-pin compatible and cannot be interchanged on the same PCB without redesign.
No. Beyond the package and pin count mismatch, the 10CL080YF780I7G offers 80,000 logic elements versus 16,000 logic elements in the 10CL016YF484C8G. A design requiring the larger density cannot be implemented in the smaller device without significant logic reduction or redesign.
The 10CL080YF780I7G is specified for industrial temperature range (typically -40°C to +100°C junction temperature, indicated by the "I" in the part number). The 10CL016YF484C8G is specified for commercial temperature range (typically 0°C to +85°C junction temperature, indicated by the "C" in the part number). The industrial-grade device is suitable for harsher environments.
Yes. Both are Intel (Altera) Cyclone 10 LP family FPGAs. They support the same configuration schemes, including active serial (AS), passive serial (PS), and JTAG configuration, using external configuration devices or a host controller. However, the configuration bitstream is device-specific and not interchangeable between different densities.
The 10CL080YF780I7G, with its larger 780-pin FBGA package, provides more user I/O pins than the 10CL016YF484C8G with its 484-pin FBGA package. The exact number of user I/O pins depends on the specific package and is documented in the respective Intel Cyclone 10 LP device pin-out files. Designers should consult the official pin-out documentation for precise counts.
Intel Cyclone 10 LP devices, including the 10CL080YF780I7G and 10CL016YF484C8G, are offered in RoHS-compliant, lead-free packages as standard. The "G" suffix in both part numbers indicates RoHS compliance. Designers should verify the specific ordering code and packaging options against the Intel product catalog for the latest compliance status.
Both devices require external configuration memory since Cyclone 10 LP FPGAs are SRAM-based. The configuration file size differs by density: the 10CL080YF780I7G requires a larger configuration bitstream than the 10CL016YF484C8G. The exact configuration file size in bits is specified in the Intel Cyclone 10 LP Device Overview and configuration user guides. A larger configuration device or flash memory may be needed for the higher-density part.