Part A
10M25DAF484C8G
Интель
- Lifecycle
- Active
- Stock
- 4515 ПКС
- Package
- FBGA-484
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M25DAF484C8G and 10M25DCF484C7G are both Intel MAX 10 FPGA devices in the same 484-pin FBGA package with identical logic density, memory resources, and I/O count, making them functionally interchangeable for most designs. The primary distinction lies in speed grade and temperature range, so the 10M25DCF484C7G can serve as a replacement for the 10M25DAF484C8G provided the target application tolerates the faster speed grade and the narrower commercial temperature window.
Logic Density
High match
Package Type
High match
Speed Grade
Validation required
Operating Temperature
Validation required
Parts at a glance
Part B
10M25DCF484C7G
Интель
- Lifecycle
- Active
- Stock
- 6451 ПКС
- Package
- BGA-484
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M25DAF484C8G | 10M25DCF484C7G | Why it matters |
|---|---|---|---|
| Family | MAX 10 | MAX 10 | Both devices belong to the same FPGA family, which supports similar design flows and IP compatibility. |
| Logic Elements (LEs) | 25,000 | 25,000 | Matching logic capacity ensures equivalent design density and resource availability. |
| Package | FBGA-484 | FBGA-484 | Identical package and pinout allow drop-in replacement on the same PCB footprint. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Same temperature grade ensures suitability for the same environmental conditions. |
| Speed Grade | 8 | 7 | Different speed grades affect maximum operating frequency and timing closure; a faster grade may be required for higher-performance designs. |
| Embedded Memory (M9K) | 1,080 Kbits | 1,080 Kbits | Equal embedded memory supports the same on-chip buffering and storage requirements. |
| User I/O Pins | 360 | 360 | Same I/O count ensures compatibility with existing interface and peripheral connections. |
| Configuration Method | Instant-on, dual configuration | Instant-on, dual configuration | Identical configuration features support the same boot and fail-safe strategies. |
| Supply Voltage | 1.2 V core | 1.2 V core | Same core voltage simplifies power supply design and ensures electrical compatibility. |
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Send your BOM and application constraints for technical and sourcing review.
Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M25DAF484C8G | 10M25DCF484C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 1563 | 1563 |
| Number of Logic Elements/Cells | 25000 | 25000 |
| Total RAM Bits | 691200 | 691200 |
| Number of I/O | 360 | 360 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 10M25DAF484C8G and the 10M25DCF484C7G?
The primary differences are the speed grade and the operating temperature range. The 10M25DAF484C8G is specified with a speed grade of 8 and an extended temperature range of 0°C to 85°C (commercial). The 10M25DCF484C7G is specified with a faster speed grade of 7 and an industrial temperature range of -40°C to 100°C (junction). Both devices are Intel MAX 10 FPGA devices with 25,000 logic elements in a 484-pin FineLine BGA (FBGA) package.
Are the 10M25DAF484C8G and 10M25DCF484C7G pin-to-pin compatible?
Yes. Both devices share the same 484-pin FineLine BGA (FBGA) package with identical pinouts as defined by the Intel MAX 10 device family. The package designation "F484" is common to both ordering codes, so the physical footprint and pin assignments are the same.
Can the 10M25DAF484C8G be used as a direct drop-in replacement for the 10M25DCF484C7G?
Not without design validation. Although the package and pinout are identical, the 10M25DCF484C7G has a faster speed grade (7 vs. 8) and a wider industrial temperature range (-40°C to 100°C vs. 0°C to 85°C). Timing closure, power consumption, and thermal performance must be re-verified against the target design requirements before substitution.
What is the logic capacity of the 10M25DAF484C8G and 10M25DCF484C7G?
Both devices feature 25,000 logic elements (LEs) as part of the Intel MAX 10 FPGA family. They also include the same embedded memory blocks, DSP blocks, and analog-to-digital converter (ADC) blocks as defined by the MAX 10 25K device variant.
Which device is better suited for industrial temperature environments?
The 10M25DCF484C7G is better suited for industrial temperature environments. Its ordering code includes the "I" temperature grade, which specifies operation over the industrial range of -40°C to 100°C junction temperature. The 10M25DAF484C8G is rated for the commercial range of 0°C to 85°C.
Does the speed grade difference between the 10M25DAF484C8G and 10M25DCF484C7G affect power consumption?
Yes. The 10M25DCF484C7G has a faster speed grade (7) compared to the 10M25DAF484C8G (8). Faster speed grades typically consume more dynamic power at the same operating frequency due to lower threshold voltages and faster transistor switching. Exact power figures must be obtained from the Intel MAX 10 power estimation tools using the specific design configuration.
Are both devices RoHS compliant and lead-free?
Yes. Both the 10M25DAF484C8G and 10M25DCF484C7G are offered in RoHS-compliant, lead-free packages as standard Intel FPGA ordering options. The "G" suffix in both ordering codes indicates RoHS compliance and lead-free construction.
What configuration options are available for the 10M25DAF484C8G and 10M25DCF484C7G?
Both devices support the same configuration schemes as part of the Intel MAX 10 family, including internal configuration flash, dual configuration images, and external configuration via JTAG or active serial modes. The configuration method is determined by the device family and is not affected by the speed grade or temperature grade differences between these two ordering codes.