10M50DCF256A7G
Альтера
- Lifecycle
- Active
- Stock
- 5161 ПКС
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Это подробное сравнение 10M50DCF256A7G и 10M50DAF256I6G предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.
Replacement verdict
The 10M50DAF256I6G and 10M50DCF256A7G are both Intel MAX 10 FPGA devices sharing the same 50,000 logic element density and 256-ball FineLine BGA footprint, making them functionally interchangeable at the board level. However, they differ in speed grade and operating temperature range, so the 10M50DCF256A7G should only be considered a direct substitute for the 10M50DAF256I6G in applications where the relaxed speed and commercial temperature ratings are acceptable. Designers must validate timing closure and thermal margins before committing to this replacement.
Альтера
Интель
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M50DAF256I6G | 10M50DCF256A7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both parts belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 50,000 | 50,000 | Matching logic density ensures equivalent programmable logic capacity for the target design. |
| Package | 256-pin FBGA | 256-pin FBGA | Identical package and pin count allow the same PCB footprint and board layout. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | The industrial-grade part supports harsher environments, while the commercial part is limited to benign conditions; this affects deployment in automotive, industrial, or outdoor systems. |
| Speed Grade | 6 (faster) | 7 (slower) | Speed grade determines maximum operating frequency and timing closure; a slower grade may not meet the same performance targets. |
| Embedded Memory (M9K blocks) | 1,638 Kbits | 1,638 Kbits | Equal embedded memory capacity supports the same on-chip buffering, FIFO, and data storage requirements. |
| User I/O Pins | 178 | 178 | Matching I/O count ensures the same number of external interfaces can be supported without redesign. |
| Analog-to-Digital Converter (ADC) | Yes (12-bit, 1 Msps) | Yes (12-bit, 1 Msps) | Both include the same integrated ADC, which is critical for analog sensing and monitoring applications. |
| Configuration Flash Memory | Yes (dual configuration) | Yes (dual configuration) | Integrated configuration flash enables instant-on operation and eliminates the need for external configuration devices. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage means the same power supply design and decoupling network can be reused. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M50DCF256A7G | 10M50DAF256I6G |
|---|---|---|
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Digi Key Programmable | Not Verified | - |
| Total RAM Bits | 1677312 | 1677312 |
| Number of I/O | 178 | 178 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TJ) | -40°C ~ 100°C (TJ) |
| Number of Logic Elements / Cells | 50000 | - |
| Number of LA Bs / CL Bs | 3125 | - |
| Number of LABs/CLBs | - | 3125 |
| Number of Logic Elements/Cells | - | 50000 |
The 10M50DAF256I6G is a MAX 10 FPGA with 50,000 logic elements in a 256-pin FineLine BGA package, rated for industrial temperature grade (I6) with a speed grade of 6. The 10M50DCF256A7G is also a MAX 10 FPGA with 50,000 logic elements in a 256-pin FineLine BGA package, but it is rated for automotive temperature grade (A7) with a speed grade of 7. The primary differences are the temperature grade, speed grade, and the associated operating conditions and performance characteristics.
Both devices are offered in the same 256-pin FineLine BGA (FBGA) package, which typically provides the same physical footprint and ball map for the MAX 10 family. However, designers must verify the pinout and any device-specific configuration pins against the respective datasheets before considering them drop-in replacements, as I/O standards and dedicated pin functions may differ by speed grade or temperature grade options.
The 10M50DAF256I6G is specified for industrial temperature range, typically -40°C to +100°C junction temperature (TJ). The 10M50DCF256A7G is specified for automotive temperature range, typically -40°C to +125°C junction temperature (TJ). The exact limits should be confirmed in the respective device datasheets, as the automotive grade supports a wider high-temperature range.
No, the 10M50DAF256I6G is rated for industrial temperature range and is not qualified to automotive standards. The 10M50DCF256A7G is the automotive-grade variant and should be used for automotive applications requiring AEC-Q100 qualification and the extended temperature range. Substitution would require validation against the target application's environmental and reliability requirements.
The 10M50DAF256I6G has a speed grade of 6, while the 10M50DCF256A7G has a speed grade of 7. In Intel MAX 10 FPGA nomenclature, a lower speed grade number generally indicates faster performance. Therefore, the 10M50DAF256I6G (speed grade 6) typically offers higher maximum operating frequencies and lower propagation delays compared to the 10M50DCF256A7G (speed grade 7). Designers must re-timing-analyze if swapping between these speed grades.
Both devices are members of the Intel MAX 10 FPGA family and support similar configuration features, including internal configuration flash, dual configuration images, and instant-on capability. However, the exact configuration options, including supported configuration schemes and any device-specific settings, should be verified in the respective datasheets, as temperature grade and speed grade may affect certain configuration timing parameters.
The 10M50DAF256I6G is typically used in industrial applications such as motor control, industrial networking, and embedded systems requiring a balance of performance and industrial temperature support. The 10M50DCF256A7G is designed for automotive applications such as advanced driver assistance systems (ADAS), infotainment, and vehicle networking, where automotive qualification and extended temperature range are required.
Intel MAX 10 FPGA devices, including the 10M50DAF256I6G and 10M50DCF256A7G, are generally available in RoHS-compliant packages. However, compliance status can vary by ordering code and packaging option. Designers should confirm RoHS and lead-free status through the manufacturer's product material declaration or distributor documentation for the specific ordering part number.