5CEBA2F17C8N vs 5CEBA7F23C7N

Это подробное сравнение 5CEBA2F17C8N и 5CEBA7F23C7N предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEBA7F23C7N and 5CEBA2F17C8N are not functionally interchangeable. They differ in logic density, package footprint, transceiver count, and speed grade, so the 5CEBA2F17C8N cannot directly replace the 5CEBA7F23C7N in an existing design without significant redesign.

Different logic density Different package footprint Different transceiver count Different speed grade

Parts at a glance

Part A

5CEBA2F17C8N

Интель

Lifecycle
Active
Stock
4153 ПКС
Package
BGA-256
Series
Встроенные - FPGA (Field Programmable Gate Array)
Part B

5CEBA7F23C7N

Интель

Lifecycle
Active
Stock
4498 ПКС
Package
FBGA-484
Series
Встроенные - FPGA (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEBA7F23C7N 5CEBA2F17C8N Why it matters
Family / Series Cyclone V E Cyclone V E Both belong to the Cyclone V E family, so they share the same architecture and toolchain, but differ in density and package.
Logic Elements (LEs) 150,000 25,000 LE count determines the amount of programmable logic available; a large difference means the two devices are not functionally interchangeable for complex designs.
Adaptive Logic Modules (ALMs) 56,480 9,430 ALMs are the basic building blocks of the FPGA fabric; the count directly affects achievable logic capacity.
Embedded Memory (M10K) 6,860 Kb 1,400 Kb On-chip memory capacity affects buffering, FIFO depth, and data storage within the FPGA; the larger device offers significantly more.
18x18 Multipliers 312 50 Dedicated multipliers are essential for DSP and arithmetic-heavy applications; the count limits parallel processing capability.
Package FBGA-484 FBGA-256 Different packages have different footprints and pin counts, so they are not drop-in replacements on a PCB.
Speed Grade 7 8 Speed grade indicates maximum operating frequency; a lower number is faster, affecting timing closure and performance.
Operating Temperature Range 0°C to 85°C (Commercial) 0°C to 85°C (Commercial) Both are commercial-grade, so they suit the same ambient conditions, but this does not compensate for other differences.
Supply Voltage (Core) 1.1 V 1.1 V Core voltage must match the board power design; identical values mean power delivery is compatible.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEBA2F17C8N 5CEBA7F23C7N
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 9434 56480
Number of Logic Elements/Cells 25000 149500
Total RAM Bits 2002944 7880704
Number of I/O 128 240
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEBA7F23C7N and the 5CEBA2F17C8N?

The 5CEBA7F23C7N is a larger Cyclone V E FPGA in the F23 package with 150K logic elements, 686 user I/O pins, and a speed grade of C7. The 5CEBA2F17C8N is a smaller Cyclone V E FPGA in the F17 package with 25K logic elements, 240 user I/O pins, and a speed grade of C8. The 5CEBA7F23C7N offers significantly higher logic density and I/O count, while the 5CEBA2F17C8N provides a lower-cost, lower-power solution for smaller designs.

Are the 5CEBA7F23C7N and 5CEBA2F17C8N pin-to-pin compatible?

No. The 5CEBA7F23C7N uses a 484-pin FBGA package (F23), while the 5CEBA2F17C8N uses a 256-pin FBGA package (F17). The package sizes, ball counts, and pinouts differ, so they are not pin-to-pin compatible and cannot be interchanged on the same PCB footprint.

Can the 5CEBA2F17C8N be used as a direct drop-in replacement for the 5CEBA7F23C7N?

No. The two devices differ in logic density, package, pin count, I/O count, and speed grade. A direct drop-in replacement is not possible without redesigning the PCB, power delivery, and configuration circuitry, and re-validating the design against the target device's timing and resource constraints.

What are the logic element counts for the 5CEBA7F23C7N and 5CEBA2F17C8N?

The 5CEBA7F23C7N contains 150,000 logic elements (LEs). The 5CEBA2F17C8N contains 25,000 logic elements (LEs). This six-fold difference in logic capacity makes the 5CEBA7F23C7N suitable for larger, more complex designs, while the 5CEBA2F17C8N is intended for smaller, cost-sensitive applications.

What are the maximum user I/O counts for these two FPGAs?

The 5CEBA7F23C7N provides up to 686 user I/O pins. The 5CEBA2F17C8N provides up to 240 user I/O pins. The higher I/O count of the 5CEBA7F23C7N supports more peripheral interfaces and wider data buses.

What speed grades are available for the 5CEBA7F23C7N and 5CEBA2F17C8N?

The 5CEBA7F23C7N is specified with a C7 speed grade. The 5CEBA2F17C8N is specified with a C8 speed grade. In Altera/Intel Cyclone V nomenclature, a lower number indicates a faster speed grade, so the C7 device offers higher performance than the C8 device.

Do both devices belong to the same FPGA family and series?

Yes. Both the 5CEBA7F23C7N and the 5CEBA2F17C8N are members of the Intel (formerly Altera) Cyclone V E FPGA family. They share the same architecture, configuration scheme, and supported IP ecosystem, but differ in density, package, I/O count, and speed grade.

What package types are used by the 5CEBA7F23C7N and 5CEBA2F17C8N?

The 5CEBA7F23C7N is housed in a 484-pin FineLine BGA (FBGA) package, designated F23. The 5CEBA2F17C8N is housed in a 256-pin FineLine BGA (FBGA) package, designated F17. Both are surface-mount FBGA packages but with different ball counts and body sizes.