5CEFA4F23I7N
Интель
- Lifecycle
- Active
- Stock
- 6968 ПКС
- Package
- FBGA-484
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Это подробное сравнение 5CEFA4F23I7N и 5CEFA2M13C8N предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.
Replacement verdict
The 5CEFA4F23I7N and 5CEFA2M13C8N are both Intel (Altera) Cyclone V FPGAs sharing the same core architecture and logic cell family, making them functionally related candidates. However, they differ in logic density, package footprint, and operating temperature grade, so a direct drop-in substitution is not possible without design review. The 5CEFA4F23I7N offers higher logic capacity and industrial temperature support, while the 5CEFA2M13C8N provides a smaller package and commercial temperature range. Validation of logic utilization, board layout, and thermal requirements is required before considering either device as a replacement for the other.
Интель
Интель
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA4F23I7N | 5CEFA2M13C8N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout compatibility for substitution. |
| Logic Elements (LE) | 49,000 | 25,000 | Logic capacity determines whether a design fits; a smaller device may not accommodate the same logic. |
| Package | FBGA-484 | MBGA-383 | Different packages have different footprints and pin counts, preventing direct board-level drop-in replacement. |
| Operating Temperature Range | -40°C to +100°C (Industrial) | 0°C to +85°C (Commercial) | Temperature grade affects reliability in harsh environments; industrial parts are required for extended temperature applications. |
| Speed Grade | 7 (Fastest) | 8 (Slowest) | Speed grade impacts maximum operating frequency and timing closure; a slower grade may not meet performance requirements. |
| Embedded Memory (M10K blocks) | 308 | 140 | On-chip memory capacity affects buffering, FIFO depth, and data storage capability within the FPGA. |
| 18x18 Multipliers | 140 | 72 | DSP resources determine signal processing throughput and parallel arithmetic capability. |
| Maximum User I/O | 224 | 175 | I/O count limits peripheral connectivity and interface options for the design. |
| PLLs | 4 | 4 | PLL count affects clock generation and distribution flexibility across the design. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA4F23I7N | 5CEFA2M13C8N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 18480 | 9434 |
| Number of Logic Elements/Cells | 49000 | 25000 |
| Total RAM Bits | 3464192 | 2002944 |
| Number of I/O | 224 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
The 5CEFA4F23I7N is a Cyclone V FPGA with 49,000 logic elements, 308 embedded multipliers, and 3,880 Kbits of embedded memory in a 484-pin FBGA package, rated for industrial temperature range (I7). The 5CEFA2M13C8N is a Cyclone V FPGA with 25,000 logic elements, 150 embedded multipliers, and 1,960 Kbits of embedded memory in a 383-pin Micro FBGA package, rated for commercial temperature range (C8). The 5CEFA4F23I7N offers higher logic density, more memory, and a wider temperature range, while the 5CEFA2M13C8N provides a smaller package and lower power consumption for cost-sensitive commercial applications.
No. The 5CEFA4F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13C8N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The different package sizes, pin counts, and ball maps make them physically and electrically incompatible for direct PCB replacement.
No. The 5CEFA2M13C8N has fewer logic elements (25,000 vs 49,000), fewer embedded multipliers (150 vs 308), less embedded memory (1,960 Kbits vs 3,880 Kbits), a different package (383-pin Micro FBGA vs 484-pin FBGA), and a commercial temperature grade (C8) versus the industrial grade (I7) of the 5CEFA4F23I7N. A direct substitution would require a complete redesign of the PCB and verification that the reduced resources meet the application requirements.
The 5CEFA4F23I7N is rated for the industrial temperature range, typically -40°C to +100°C junction temperature (I7 grade). The 5CEFA2M13C8N is rated for the commercial temperature range, typically 0°C to +85°C junction temperature (C8 grade). The industrial-grade device is suitable for harsh environments, while the commercial-grade device is intended for controlled environments.
The 5CEFA2M13C8N generally consumes less power due to its smaller logic density (25,000 LE vs 49,000 LE), lower embedded memory, and commercial temperature grade. However, actual power consumption depends on the specific design, clock frequencies, and I/O usage. Altera/Intel PowerPlay Early Power Estimator tools should be used for accurate comparison in a given application.
Both are Cyclone V FPGAs and share the same configuration schemes (active serial, passive serial, JTAG, etc.). However, the 5CEFA4F23I7N (F23 package) supports up to 6 transceivers at 3.125 Gbps, while the 5CEFA2M13C8N (M13 package) supports up to 2 transceivers at 3.125 Gbps. The number of available high-speed transceiver channels differs due to package and device variant.
The 5CEFA4F23I7N is typically used in industrial automation, motor control, medical imaging, and harsh-environment applications requiring higher logic density and industrial temperature support. The 5CEFA2M13C8N is commonly used in consumer electronics, portable devices, and cost-sensitive commercial applications where small package size and lower power are critical.
Yes. Both the 5CEFA4F23I7N and 5CEFA2M13C8N are offered in RoHS-compliant, lead-free packages as standard from Intel (formerly Altera). However, customers should verify the specific ordering code and packaging options with the manufacturer or authorized distributor to confirm compliance for their production requirements.