Part A
5CEFA7F23I7N
Интель
- Lifecycle
- Active
- Stock
- 7313 ПКС
- Package
- FBGA-484
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Replacement verdict
Not a drop-in replacement
The 5CEFA7F23I7N and 5CEFA2M13C6N are not drop-in replacements for each other. They differ fundamentally in logic density, package footprint, speed grade, and operating temperature range, making them suitable for different design requirements rather than interchangeable substitutes.
Different logic density
Different package footprint
Different speed grade
Different temperature range
Parts at a glance
Part B
5CEFA2M13C6N
Интель
- Lifecycle
- Active
- Stock
- 4768 ПКС
- Package
- TFBGA-383
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA7F23I7N | 5CEFA2M13C6N | Why it matters |
|---|---|---|---|
| Family / Series | Cyclone V E | Cyclone V E | Same FPGA family ensures toolchain, IP, and pinout compatibility for substitution. |
| Logic Elements (LE) | 149,500 | 25,000 | Logic capacity determines whether a design fits; a smaller device cannot host a larger design. |
| Total RAM (Mbits) | 7.9 | 1.9 | Embedded memory affects buffering, FIFO depth, and on-chip data storage capability. |
| 18x18 Multipliers | 312 | 72 | DSP resources limit arithmetic throughput for signal processing and math-intensive logic. |
| Package | FBGA-484 | MBGA-383 | Different packages are not footprint-compatible, requiring PCB redesign for substitution. |
| Operating Temperature | -40°C to 100°C (Industrial) | 0°C to 85°C (Commercial) | Temperature grade determines suitability for industrial versus commercial environments. |
| Speed Grade | 7 (faster) | 6 (slower) | Speed grade affects maximum clock frequency and timing closure margins. |
| Supply Voltage (Core) | 1.1 V | 1.1 V | Core voltage compatibility is required for power supply design reuse. |
| Number of I/O Pins | 224 | 175 | I/O count limits peripheral interfaces and must meet system connectivity needs. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA7F23I7N | 5CEFA2M13C6N |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 56480 | 9434 |
| Number of Logic Elements/Cells | 149500 | 25000 |
| Total RAM Bits | 7880704 | 2002944 |
| Number of I/O | 240 | 223 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA7F23I7N and the 5CEFA2M13C6N?
The 5CEFA7F23I7N is a Cyclone V FPGA with 149,500 logic elements, 7,696 Kbits of embedded memory, and 480 18x18 multipliers in a 484-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C). The 5CEFA2M13C6N is a Cyclone V FPGA with 25,000 logic elements, 1,536 Kbits of embedded memory, and 72 18x18 multipliers in a 383-pin Micro FBGA package, rated for commercial temperature range (TJ = 0°C to 85°C).
Are the 5CEFA7F23I7N and 5CEFA2M13C6N pin-to-pin compatible?
No. The 5CEFA7F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2M13C6N uses a 383-pin Micro FBGA package (13 mm x 13 mm). The package sizes, pin counts, and ball maps differ, so they are not pin-to-pin compatible.
Can the 5CEFA2M13C6N be used as a direct drop-in replacement for the 5CEFA7F23I7N?
No. The two devices differ in logic density, embedded memory, multiplier count, package footprint, pin count, and temperature grade. A direct drop-in replacement is not possible without redesigning the PCB and revalidating the logic design against the smaller device's resources.
What are the operating temperature ranges for these two FPGAs?
The 5CEFA7F23I7N is specified for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2M13C6N is specified for commercial temperature range with a TJ of 0°C to 85°C.
How do the logic element counts compare between the 5CEFA7F23I7N and 5CEFA2M13C6N?
The 5CEFA7F23I7N contains 149,500 logic elements (LEs), while the 5CEFA2M13C6N contains 25,000 LEs. The 5CEFA7F23I7N offers approximately six times the logic capacity of the 5CEFA2M13C6N.
Do both devices support the same transceiver speeds and high-speed interfaces?
Both are Cyclone V FPGA devices, but the 5CEFA7F23I7N (F23 package) supports up to 6.144 Gbps transceivers, while the 5CEFA2M13C6N (M13 package) supports up to 3.125 Gbps transceivers. The number of transceiver channels also differs between the two packages. Designers must verify the specific transceiver count and speed grade in the respective device pin-out files and datasheets.
What are the typical applications for each device?
The 5CEFA7F23I7N, with higher logic density, more memory, and industrial temperature support, is typically used in industrial automation, motor control, medical imaging, and communication infrastructure. The 5CEFA2M13C6N, with lower density and commercial temperature rating, is typically used in consumer electronics, portable devices, and cost-sensitive embedded applications.
Are the configuration and power supply requirements the same for both devices?
Both devices belong to the Cyclone V family and share similar configuration schemes (e.g., active serial, passive serial, JTAG) and core voltage requirements (typically 1.1 V). However, the 5CEFA7F23I7N may require additional power supply pins and decoupling due to its larger package and higher logic count. Always consult the respective device datasheets and pin-out files for exact power supply and configuration pin requirements.