AM1808EZWTA3 vs AM1806BZWT3

Это подробное сравнение AM1808EZWTA3 и AM1806BZWT3 предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The AM1806BZWT3 is a viable functional replacement candidate for the AM1808EZWTA3 in designs where the reduced on-chip memory and peripheral set are acceptable. Both devices share the same ARM926EJ-S core, BGA package footprint, and industrial temperature range, but the AM1808EZWTA3 offers additional integrated features that the AM1806BZWT3 does not provide. Designers should validate memory requirements and peripheral needs before substituting.

Core Architecture High match
Package Type High match
On-Chip Memory Validation required
Integrated Peripherals Validation required

Parts at a glance

Part A

AM1808EZWTA3

Техасские инструменты

Lifecycle
Active
Stock
4875 ПКС
Package
NFBGA-361
Series
Встроенные - микропроцессоры
Part B

AM1806BZWT3

Техасские инструменты

Lifecycle
Active
Stock
6789 ПКС
Package
LFBGA-361
Series
Встроенные - микропроцессоры

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter AM1808EZWTA3 AM1806BZWT3 Why it matters
Core Processor ARM926EJ-S ARM926EJ-S Both use the same ARM926EJ-S core, so instruction set and software compatibility are identical.
Number of Cores 1 1 Single-core configuration means equivalent processing architecture for both parts.
Max Clock Frequency 456 MHz 456 MHz Identical maximum operating frequency ensures the same performance ceiling for timing-critical designs.
Package / Case 361-LFBGA (16x16) 361-LFBGA (16x16) Same package and footprint allow drop-in PCB compatibility without layout changes.
Operating Temperature Range -40°C to 105°C -40°C to 105°C Matching industrial temperature ranges ensure equivalent environmental robustness.
On-Chip RAM 128 KB 128 KB Equal internal SRAM affects buffer capacity and real-time data handling identically.
Ethernet Interface 10/100 Mbps MAC 10/100 Mbps MAC Both integrate the same Ethernet MAC, supporting equivalent networked application designs.
USB Interface USB 2.0 OTG + Host USB 2.0 OTG + Host Identical USB capabilities determine peripheral connectivity options for both parts.
Supply Voltage 1.2V core / 1.8V-3.3V I/O 1.2V core / 1.8V-3.3V I/O Same voltage rails allow reuse of the same power supply design for either part.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification AM1808EZWTA3 AM1806BZWT3
Supplier - Texas Instruments
Series Sitara™ Sitara™
Part Status Active Obsolete
Core Processor ARM926EJ-S ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 375MHz 375MHz
Co - Processors / DSP System Control; CP15 System Control; CP15
RAM Controllers LPDDR, DDR2 LPDDR, DDR2
Graphics Acceleration No No
Display&Interface Controllers LCD LCD
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1) USB 2.0 + PHY (1)
Voltage - I / O 1.8V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 105°C (TJ) 0°C ~ 90°C (TJ)
Ethernet 10/100Mbps (1) -
SATA SATA 3Gbps (1) -

Frequently asked questions

What are the key differences between the AM1808EZWTA3 and AM1806BZWT3?

The AM1808EZWTA3 is based on the AM1808 SoC, which includes an ARM926EJ-S core plus an integrated LCD controller and a SATA controller, while the AM1806BZWT3 is based on the AM1806 SoC, which omits the LCD controller and SATA interface. Both are Sitara ARM9 devices in a 361-ball NFBGA (ZWT) package, but the AM1808EZWTA3 is rated for the extended temperature range (A3 suffix, -40°C to 105°C) whereas the AM1806BZWT3 is rated for the commercial/industrial temperature range (3 suffix, 0°C to 90°C).

Are the AM1808EZWTA3 and AM1806BZWT3 pin-compatible?

Both devices are offered in the same 361-ball ZWT NFBGA package, but they are not functionally interchangeable because the AM1808 exposes LCD and SATA interfaces that the AM1806 does not. Pin assignments must be verified against the respective datasheets before any board-level substitution.

What is the operating temperature range of each device?

The AM1808EZWTA3 (A3 speed/temperature grade) is specified for the extended industrial range of -40°C to 105°C. The AM1806BZWT3 (3 grade) is specified for 0°C to 90°C. Designs requiring extended temperature operation should use the A3-graded device.

Do both parts include an LCD controller?

No. The AM1808EZWTA3 integrates a liquid crystal display (LCD) controller, while the AM1806BZWT3 does not include an LCD controller. This is a primary functional differentiator between the two SoCs.

Does either device provide a SATA interface?

The AM1808EZWTA3 includes an integrated SATA controller. The AM1806BZWT3 does not provide a SATA interface. Systems requiring SATA storage connectivity must use the AM1808-based part.

What CPU core and clock speed do these devices use?

Both the AM1808EZWTA3 and AM1806BZWT3 use an ARM926EJ-S RISC core. The AM1808EZWTA3 is specified at 375 MHz (the "A3" speed grade), while the AM1806BZWT3 is specified at 375 MHz as well (the "3" speed grade). Core voltage and clock configuration should be confirmed against the respective datasheets.

Can the AM1806BZWT3 be used as a drop-in replacement for the AM1808EZWTA3?

No. Although both share the 361-ball ZWT package and ARM926EJ-S core, the AM1806BZWT3 lacks the LCD controller and SATA interface present on the AM1808EZWTA3, and its temperature grade differs (0°C to 90°C versus -40°C to 105°C). A drop-in replacement is not possible without design and firmware validation.

What package type do these devices use?

Both the AM1808EZWTA3 and AM1806BZWT3 are supplied in a 361-ball NFBGA (ZWT) package. PCB land pattern and thermal design should follow the manufacturer's package documentation for the ZWT outline.