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1-2324271-3
+БОМRIGHT SEGMEN LGA4189-4 SOCKET-P4
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ПроизводительTE Connectivity AMP соединения
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Мфр. Часть #1-2324271-3
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В наличии28792
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Active |
| Base Product Number | 2324271 |
| Type | LGA 4189 |
| Number of Positions or Pins (Grid) | 2092 |
| Pitch - Mating | 0.039" (1.00mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 15.0µin (0.38µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.034" (0.86mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 15.0µin (0.38µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Thermoplastic |
| Operating Temperature | -25°C ~ 100°C |
| Packaging | Tray |
Обзор
Description
I’m not sure what “1-2324271-3” refers to (it could be an ISBN, course code, or product number). Please clarify the context or provide the full name.
If you want a generic intro to an “Introduction to [topic]” piece, I can tailor it once you share the subject. In general, it covers:
- What the topic is and why it matters
- Core concepts and terminology
- Typical methods, tools, or approaches
- Common problems or applications
- Prerequisites and a suggested learning path
If you want a generic intro to an “Introduction to [topic]” piece, I can tailor it once you share the subject. In general, it covers:
- What the topic is and why it matters
- Core concepts and terminology
- Typical methods, tools, or approaches
- Common problems or applications
- Prerequisites and a suggested learning path
Package
Package type depends on the vendor and revision. The part number alone (1-2324271-3) doesn’t specify the package. Please provide the supplier (e.g., Digi-Key, Mouser, TE) or a datasheet/link, and I’ll identify the exact package (e.g., DIP, SOIC, QFN, LCC) and dimensions.
