Спецификации
| Атрибут | Ценность |
| Package / Case | Tray |
| Series | MAX® 10 |
| Part Status | Active |
| Number of LABs/CLBs | 250 |
| Number of Logic Elements/Cells | 4000 |
| Total RAM Bits | 193536 |
| Number of I/O | 246 |
| Voltage - Supply | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
Обзор
Description
The 10M04DCU324C8G is a member of Intel’s (formerly Altera) MAX® 10 FPGA family, designed for low-power, cost-sensitive applications. Key features include:
- Logic Elements: 4,000 (10K equivalent LUTs).
- Memory: 270 Kbits of embedded memory.
- I/O Pins: 324, supporting LVCMOS, LVDS, and other standards.
- Package: 324-pin UBGA (Ultra FineLine BGA).
- On-Chip Features: Dual-configuration flash, analog-to-digital converter (ADC), and PLLs.
- Process Technology: 55nm CMOS with embedded flash.
It is ideal for industrial control, automotive, and consumer electronics, offering instant-on operation, non-volatile configuration, and low power consumption. The C8G suffix indicates a commercial-grade device with a -8 speed grade.
For detailed specs, refer to Intel’s MAX 10 FPGA Device Overview documentation.
- Logic Elements: 4,000 (10K equivalent LUTs).
- Memory: 270 Kbits of embedded memory.
- I/O Pins: 324, supporting LVCMOS, LVDS, and other standards.
- Package: 324-pin UBGA (Ultra FineLine BGA).
- On-Chip Features: Dual-configuration flash, analog-to-digital converter (ADC), and PLLs.
- Process Technology: 55nm CMOS with embedded flash.
It is ideal for industrial control, automotive, and consumer electronics, offering instant-on operation, non-volatile configuration, and low power consumption. The C8G suffix indicates a commercial-grade device with a -8 speed grade.
For detailed specs, refer to Intel’s MAX 10 FPGA Device Overview documentation.
Features
The 10M04DCU324C8G is an Intel (formerly Altera) MAX 10 FPGA with the following key features:
- Logic Elements: 4,000 LEs
- Memory: 135 Kbits embedded RAM
- DSP Blocks: 12 (18x18 multipliers)
- I/O Pins: 324 (supports LVDS, LVCMOS)
- Flash Memory: 256 Kbits (user flash)
- ADC: 1 MSPS, 12-bit integrated ADC
- Clock Management: PLLs for flexible clocking
- Configuration: On-chip non-volatile flash, supports instant-on
- Package: 324-ball UBGA (8x8 mm)
- Operating Voltage: 1.2V core, 1.8V/2.5V/3.3V I/O
- Temperature Range: Commercial (0°C to 85°C)
Ideal for low-power, cost-sensitive applications like industrial control, IoT, and embedded systems.
- Logic Elements: 4,000 LEs
- Memory: 135 Kbits embedded RAM
- DSP Blocks: 12 (18x18 multipliers)
- I/O Pins: 324 (supports LVDS, LVCMOS)
- Flash Memory: 256 Kbits (user flash)
- ADC: 1 MSPS, 12-bit integrated ADC
- Clock Management: PLLs for flexible clocking
- Configuration: On-chip non-volatile flash, supports instant-on
- Package: 324-ball UBGA (8x8 mm)
- Operating Voltage: 1.2V core, 1.8V/2.5V/3.3V I/O
- Temperature Range: Commercial (0°C to 85°C)
Ideal for low-power, cost-sensitive applications like industrial control, IoT, and embedded systems.
Application
The 10M04DCU324C8G is an Intel MAX 10 FPGA, ideal for applications requiring low power, high integration, and cost efficiency. Key use cases include:
- Industrial Automation (motor control, PLCs)
- Embedded Systems (sensor interfacing, edge computing)
- Consumer Electronics (display controllers, IoT devices)
- Communications (protocol bridging, signal processing)
- Automotive (infotainment, ADAS peripherals)
Its compact size, flash-based configuration, and mixed-signal capabilities make it suitable for space-constrained, power-sensitive designs.
- Industrial Automation (motor control, PLCs)
- Embedded Systems (sensor interfacing, edge computing)
- Consumer Electronics (display controllers, IoT devices)
- Communications (protocol bridging, signal processing)
- Automotive (infotainment, ADAS peripherals)
Its compact size, flash-based configuration, and mixed-signal capabilities make it suitable for space-constrained, power-sensitive designs.
Package
The 10M04DCU324C8G is an Intel MAX 10 FPGA in a 324-pin UBGA (Ultra FineLine Ball Grid Array) package. This compact, surface-mount package is designed for high-density applications, offering robust performance in a small footprint. The "DCU" in the part number indicates the UBGA package type, while "324" specifies the pin count. Suitable for industrial and embedded systems.
