9DBV0441AKLF

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9DBV0441AKLF

+БОМ

IC CLOCK BUFFER 32MLF

  • Производителькомпанией Renesas Electronics America Inc

  • Мфр. Часть #9DBV0441AKLF

  • Пакет VFQFN-32

  • В наличии4483

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Supplier Renesas Electronics America Inc
Package / Case Tray
Part Status Active
PLL Yes
Main Purpose Ethernet, PCI Express (PCIe)
Input HCSL
Output HCSL
Number of Circuits 1
Ratio - Input: Output 1:4
Differential - Input: Output Yes/Yes
Frequency - Max 137.5MHz
Voltage - Supply 1.7V ~ 1.9V
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount

Обзор

Description

Introduction: 9DBV0441AKLF is a part code used to identify a specific electronic component. Without the manufacturer's datasheet or context, the exact function cannot be confirmed. Codes like this typically encode product family, voltage/current ratings, package style, and revision/lot information. A precise intro would usually cover: device type (IC, diode, regulator, transistor, sensor, connector, etc), primary electrical specs (nominal voltage/current, power dissipation), package and pinout, operating temperature, main features, and typical applications.
How to get a definitive intro: search the exact part number on the manufacturer’s site or authorized distributors to obtain the datasheet; verify packaging markings; check the bill of materials or procurement records.
If you share the manufacturer, intended application, or packaging, I can draft a concise, one‑paragraph introduction with the key specs and typical use cases.

Pinout

I don’t have the pin count or function for 9DBV0441AKLF in my database. Please provide the manufacturer or a link to the datasheet. With the exact datasheet, I can give you the pin count and device function (e.g., 8-pin SOIC/TSSOP, package type, and the pinout).

Package

I don’t have the package type for 9DBV0441AKLF in my data. Please provide the manufacturer or a datasheet/link. I can identify the package (e.g., QFN, DFN, SOIC, SOT-23) from the mechanical data.

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