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DS90LV110TMTC
+БОМIC CLK BUF 1:10 400MHZ 28TSSOP
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ПроизводительТехасские инструменты
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Мфр. Часть #DS90LV110TMTC
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Пакет TSSOP (PW)-28
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В наличии5788
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Package | Bulk,Tube |
| ProductStatus | Not For New Designs |
| Type | Fanout Buffer (Distribution) |
| NumberofCircuits | 1 |
| Ratio-Input:Output | 1:10 |
| Differential-Input:Output | Yes/Yes |
| Input | LVDS, LVPECL, PECL |
| Output | LVDS |
| Frequency-Max | 400 MHz |
| Voltage-Supply | 3V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C |
| MountingType | Surface Mount |
| Package/Case | 28-TSSOP (0.173, 4.40mm Width) |
Обзор
Description
The device features a robust design with inherent signal integrity benefits due to LVDS technology, which ensures reliable performance in electrically noisy environments. The DS90LV110TMTC typically supports low power dissipation and requires minimal external components, simplifying design and reducing cost. Its small footprint and high output drive capability make it an ideal choice for systems requiring multiple synchronized outputs from a single LVDS source. The IC is available in a compact TSSOP package, which aids in space-constrained applications while providing excellent thermal performance.
Equivalent
1. Texas Instruments' SN65LV1023A
2. National Semiconductor's DS90LV110T (variant)
3. ON Semiconductor's MC100LVEP111
These alternatives offer comparable features and are suitable for applications needing LVDS deserialization. Always verify compatibility with your specific application requirements.
Features
1. High-Speed Performance: Supports data rates up to 600 Mbps (300 MHz).
2. Low Power Consumption: Operates with reduced power usage due to its LVDS technology.
3. Low Noise and EMI: Provides low electromagnetic interference, thanks to differential signaling.
4. Wide Supply Voltage Range: Typically operates at 3.3V.
5. Output Enable Control: Features an output enable (OE) pin for tri-state functionality.
6. Spread Spectrum Clock Compatibility: Can handle spread spectrum clock inputs effectively.
7. Jitter Performance: Offers excellent jitter characteristics for reliable data transmission.
8. Temperature Range: Operates over an industrial temperature range.
9. Package Type: Available in a TSSOP package, aiding in compact and efficient designs.
10. Signal Integrity: Ensures signal integrity over long trace lengths.
These features make the DS90LV110TMTC suitable for data communication systems requiring high-speed data transfer with minimal power consumption and interference.
Pinout
The DS90LV110TMTC comes in a TSSOP (Thin Shrink Small Outline Package) with a total pin count of 28. The key functions of the pins include the LVDS input, LVDS outputs, power supply pins (VCC and GND), and control/configuration pins. The LVDS input pin receives the high-speed signal, and the 10 LVDS output pins distribute this signal to different parts of the system. Power supply pins ensure the chip receives adequate power, and additional pins might be used for configuration purposes or signal integrity features like enable/disable functionality.
This configuration allows for efficient and reliable high-speed signal distribution in advanced electronic systems.
Manufacturer
Application
1. Telecommunications: Enhancing data throughput in network routers and switches.
2. Consumer Electronics: Supporting high-definition video and audio data transfer.
3. Computing: Enabling high-speed connections between processors and peripherals.
4. Industrial Automation: Facilitating reliable communication in control systems and machinery.
5. Aerospace and Defense: Ensuring robust data links in avionics and military systems.
Its ability to distribute a single input to multiple outputs with minimal signal degradation makes it valuable in systems requiring precise data synchronization.