DS90LV110TMTC

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DS90LV110TMTC

+БОМ

IC CLK BUF 1:10 400MHZ 28TSSOP

  • ПроизводительТехасские инструменты

  • Мфр. Часть #DS90LV110TMTC

  • Пакет TSSOP (PW)-28

  • В наличии5788

365 Дни гарантии качества

7*24 часы обслуживания каранти

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Спецификации

Атрибут Ценность
Package Bulk,Tube
ProductStatus Not For New Designs
Type Fanout Buffer (Distribution)
NumberofCircuits 1
Ratio-Input:Output 1:10
Differential-Input:Output Yes/Yes
Input LVDS, LVPECL, PECL
Output LVDS
Frequency-Max 400 MHz
Voltage-Supply 3V ~ 3.6V
OperatingTemperature -40°C ~ 85°C
MountingType Surface Mount
Package/Case 28-TSSOP (0.173, 4.40mm Width)

Обзор

Description

The DS90LV110TMTC is a 1-to-10 LVDS (Low-Voltage Differential Signaling) data/clock driver, commonly used in high-speed data transmission applications. It is designed to deliver a single input data stream or clock to ten LVDS outputs, effectively enabling signal distribution with minimal power consumption and low noise. This IC (Integrated Circuit) operates over a wide frequency range and offers high data rates with reduced electromagnetic interference, making it suitable for networking, telecommunications, and high-performance computing systems.
The device features a robust design with inherent signal integrity benefits due to LVDS technology, which ensures reliable performance in electrically noisy environments. The DS90LV110TMTC typically supports low power dissipation and requires minimal external components, simplifying design and reducing cost. Its small footprint and high output drive capability make it an ideal choice for systems requiring multiple synchronized outputs from a single LVDS source. The IC is available in a compact TSSOP package, which aids in space-constrained applications while providing excellent thermal performance.

Equivalent

The DS90LV110TMTC is a 1:10 LVDS (Low Voltage Differential Signaling) deserializer. Equivalent products with similar functionality might include:
1. Texas Instruments' SN65LV1023A
2. National Semiconductor's DS90LV110T (variant)
3. ON Semiconductor's MC100LVEP111
These alternatives offer comparable features and are suitable for applications needing LVDS deserialization. Always verify compatibility with your specific application requirements.

Features

The DS90LV110TMTC is a 1:10 LVDS (Low Voltage Differential Signaling) fanout buffer designed for high-speed data transfer applications. Key features include:
1. High-Speed Performance: Supports data rates up to 600 Mbps (300 MHz).
2. Low Power Consumption: Operates with reduced power usage due to its LVDS technology.
3. Low Noise and EMI: Provides low electromagnetic interference, thanks to differential signaling.
4. Wide Supply Voltage Range: Typically operates at 3.3V.
5. Output Enable Control: Features an output enable (OE) pin for tri-state functionality.
6. Spread Spectrum Clock Compatibility: Can handle spread spectrum clock inputs effectively.
7. Jitter Performance: Offers excellent jitter characteristics for reliable data transmission.
8. Temperature Range: Operates over an industrial temperature range.
9. Package Type: Available in a TSSOP package, aiding in compact and efficient designs.
10. Signal Integrity: Ensures signal integrity over long trace lengths.
These features make the DS90LV110TMTC suitable for data communication systems requiring high-speed data transfer with minimal power consumption and interference.

Pinout

The DS90LV110TMTC is a 1-to-10 LVDS (Low Voltage Differential Signaling) data/clock distribution chip. It is designed to take a single LVDS input signal and distribute it to 10 identical LVDS output channels. This chip is commonly used in applications requiring the distribution of high-speed data or clock signals across multiple locations on a PCB while maintaining signal integrity and minimizing EMI (Electromagnetic Interference).
The DS90LV110TMTC comes in a TSSOP (Thin Shrink Small Outline Package) with a total pin count of 28. The key functions of the pins include the LVDS input, LVDS outputs, power supply pins (VCC and GND), and control/configuration pins. The LVDS input pin receives the high-speed signal, and the 10 LVDS output pins distribute this signal to different parts of the system. Power supply pins ensure the chip receives adequate power, and additional pins might be used for configuration purposes or signal integrity features like enable/disable functionality.
This configuration allows for efficient and reliable high-speed signal distribution in advanced electronic systems.

Manufacturer

The DS90LV110TMTC is manufactured by Texas Instruments. Texas Instruments, commonly referred to as TI, is an American technology company headquartered in Dallas, Texas. It is a major producer of semiconductors and various integrated circuits, which are used in a wide range of electronic applications. TI is particularly known for its analog chips, embedded processors, and digital signal processors. The company serves various industries, including automotive, industrial, personal electronics, and communications equipment. TI is one of the largest employers of engineers in the world and is renowned for its innovation in the field of electronics.

Application

The DS90LV110TMTC is a 1:10 LVDS (Low-Voltage Differential Signaling) data/clock distribution chip. It is primarily used in applications requiring high-speed data transmission with low power consumption and minimal electromagnetic interference. Key application areas include:
1. Telecommunications: Enhancing data throughput in network routers and switches.
2. Consumer Electronics: Supporting high-definition video and audio data transfer.
3. Computing: Enabling high-speed connections between processors and peripherals.
4. Industrial Automation: Facilitating reliable communication in control systems and machinery.
5. Aerospace and Defense: Ensuring robust data links in avionics and military systems.
Its ability to distribute a single input to multiple outputs with minimal signal degradation makes it valuable in systems requiring precise data synchronization.

Package

The DS90LV110TMTC is a Texas Instruments device that comes in a TSSOP (Thin Shrink Small Outline Package) with 28 pins. This type of package is commonly used for integrated circuits, providing a compact and efficient form factor suitable for surface mounting on printed circuit boards (PCBs).

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