EP3C55F484I7

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EP3C55F484I7

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IC FPGA 327 I/O 484FBGA

  • ПроизводительИнтель

  • Мфр. Часть #EP3C55F484I7

  • Пакет FBGA-484

  • В наличии1226

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Package Tray
Series Cyclone® III
ProductStatus Active
NumberofLABs/CLBs 3491
NumberofLogicElements/Cells 55856
TotalRAMBits 2396160
NumberofI/O 327
Voltage-Supply 1.15V ~ 1.25V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-BGA

Обзор

Description

The EP3C55F484I7 is a member of the Cyclone III FPGA family by Intel (formerly Altera). Key features:
- Logic Elements: 55,856
- Memory: 2,488 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- I/O Pins: 346 (supports LVDS, PCI, and other standards)
- Package: 484-pin FineLine BGA (FBGA)
- Operating Temperature: Industrial-grade (-40°C to 100°C)
Designed for low-power, cost-sensitive applications, it’s used in embedded systems, communications, and industrial controls. The Cyclone III series balances performance and power efficiency, making it suitable for prototyping and mid-range designs.
For development, Intel’s Quartus II software is typically used. Always refer to the official datasheet for detailed specifications.

Equivalent

The EP3C55F484I7 is a Cyclone III FPGA from Intel (formerly Altera). Equivalent alternatives include:
- EP3C40F484I7 (lower capacity)
- EP3C80F484I7 (higher capacity)
- EP4CE55F23I7 (Cyclone IV, newer but similar specs)
- Lattice ECP5 (competitive FPGA family)
Check pin compatibility and feature requirements before substitution. For exact replacements, consult Intel's cross-reference tools or distributors like Arrow, Avnet, or Digi-Key.

Features

The EP3C55F484I7 is an Altera Cyclone III FPGA with these key features:
- Logic Elements (LEs): 55,856
- Memory: 2,488 Kbits embedded RAM
- DSP Blocks: 56 (18x18 multipliers)
- Max User I/Os: 346 (supports LVDS, PCI, and other standards)
- Package: 484-pin FineLine BGA (FBGA)
- Operating Voltage: 1.15V core, 1.2V/2.5V/3.3V I/O
- Speed Grades: -6, -7, -8 (I7 denotes industrial temp range: -40°C to 100°C)
- PLLs: 4 phase-locked loops for clock management
Ideal for cost-sensitive, low-power applications like industrial control, automotive, and consumer electronics.

Pinout

The EP3C55F484I7 is a Cyclone III FPGA from Intel (formerly Altera).
- Pin Count: 484 pins (in a FineLine BGA package).
- Key Functions:
- User I/O: 346 general-purpose I/O pins.
- Power/Ground: Multiple pins for core, I/O, and PLL power.
- Configuration: Dedicated pins for JTAG, AS, and PS modes.
- Clocks: Multiple global and regional clock inputs.
- PLLs: 4 phase-locked loops for clock management.
It features 55,856 logic elements (LEs), 3.9 Mb of embedded memory, and 35 18x18 multipliers. Suitable for cost-sensitive, low-power applications.

Manufacturer

The EP3C55F484I7 is a Cyclone III FPGA manufactured by Intel (formerly Altera).
Intel is a multinational technology company known for semiconductors, processors, and programmable logic devices. After acquiring Altera in 2015, Intel integrated its FPGA technology into its product lineup.
The EP3C55F484I7 is a mid-range FPGA from the Cyclone III family, offering low power consumption and cost-effective solutions for embedded systems, industrial, and consumer applications.

Application

The EP3C55F484I7 is a Cyclone III FPGA from Intel (formerly Altera). Its key application areas include:
- Industrial Control: Automation, motor control, and PLCs.
- Communications: Baseband processing, networking, and protocol bridging.
- Consumer Electronics: Display controllers, multimedia systems.
- Medical Devices: Imaging and diagnostic equipment.
- Military/Aerospace: Ruggedized systems and avionics (with proper qualification).
Its low power, moderate logic density (~55K LEs), and cost-effectiveness make it suitable for embedded and mid-range applications.

Package

The EP3C55F484I7 is an FPGA from Intel's Cyclone III family. It comes in a 484-pin FineLine BGA (FBGA) package. This surface-mount package features a ball grid array for high-density connections, suitable for compact and high-performance designs. The "F484" in the part number indicates the FBGA-484 package type.

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