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GD25LQ16EEIGR
+БОМIC FLASH 16MBIT SPI/QUAD 8USON
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ПроизводительКомпания GigaDevice Semiconductor (HK) Limited
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Мфр. Часть #GD25LQ16EEIGR
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Лист данных GD25LQ16EEIGR DataSheet
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В наличии16442
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
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Спецификации
| Атрибут | Ценность |
| Series | GD25LQ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Memory Size | 16Mbit |
| Memory Organization | 2M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 133 MHz |
| Voltage - Supply | 1.65V ~ 2.1V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-XFDFN Exposed Pad |
| Base Product Number | GD25LQ16 |
| Technology | FLASH - NOR (SLC) |
| Write Cycle Time - Word, Page | 60µs, 2.4ms |
| Supplier Device Package | 8-USON (3x2) |
| Access Time | 6 ns |
Обзор
Description
Key features include a fast read speed, support for dual I/O operations, and a sector-erase capability, which allows for efficient data management. The GD25LQ16EEIGR can endure up to 100,000 program/erase cycles per sector, ensuring reliability and longevity. It also supports sophisticated security features like block protection and a write protection mechanism to safeguard data integrity.
The chip is typically packaged in a compact 8-pin SOIC or 8-pad WSON configuration, making it easy to integrate into various designs. Its combination of size, efficiency, and functionality makes it an appealing choice for developers needing reliable flash memory solutions.
Equivalent
1. Winbond W25X16 series
2. Micron N25Q016 series
3. Macronix MX25L1606E series
4. ISSI IS25LQ016 series
5. Adesto Technologies AT25SF161 series
These products generally offer similar storage capacities, SPI interface, and voltage operations, making them suitable alternatives depending on specific application requirements. Always verify electrical and mechanical specifications for compatibility.
Features
1. Memory Organization: It has a memory array organized as 2,097,152 bytes, providing ample storage for various applications.
2. Interface: The device uses a standard SPI (Serial Peripheral Interface) for communication, supporting SPI modes 0 and 3.
3. Performance: It offers high-speed read capabilities with a maximum clock frequency of up to 133 MHz for fast data access.
4. Supply Voltage: Operates at a low voltage range of 2.7V to 3.6V, making it suitable for battery-operated devices.
5. Program/Erase: Supports page program (256 bytes), sector erase (4 KB), block erase (32 KB and 64 KB), and chip erase operations.
6. Endurance and Retention: Ensures data reliability with 100,000 program/erase cycles per sector and data retention for over 20 years.
7. Temperature Range: It is designed to operate across a wide temperature range from -40°C to +85°C, accommodating various environmental conditions.
These features make the GD25LQ16EEIGR suitable for a wide range of applications, including consumer electronics, industrial systems, and more.
Pinout
The GD25LQ16EEIGR typically comes in an 8-pin package, such as SOP-8 or WSON-8. The pin functions are generally as follows:
1. CS# (Chip Select): Activates the device when low.
2. SCK (Serial Clock): Provides the clock signal for the SPI communication.
3. SI/IO0 (Serial Input/IO0): Used for data input, also serves as IO0 in dual/quad I/O mode.
4. SO/IO1 (Serial Output/IO1): Used for data output, also serves as IO1 in dual/quad I/O mode.
5. WP# (Write Protect): Protects against writing to the status register.
6. VCC: Power supply for the device.
7. HOLD#/IO3: Pauses the serial communication. It also acts as IO3 in quad I/O mode.
8. GND (Ground): Ground reference for the power supply.
This concise setup allows the GD25LQ16EEIGR to interface easily with microcontrollers and processors for various applications.