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ICM-20649
+БОМWIDE-FULL SCALE RANGE 6-AXIS MEM
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ПроизводительТДК InvenSense
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Мфр. Часть #ICM-20649
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В наличии7795
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Obsolete |
| Sensor Type | Accelerometer, Gyroscope, Temperature, 6 Axis |
| Output Type | I2C, SPI |
| Operating Temperature | -40°C ~ 85°C |
| Package | 24-VFQFN Module Exposed Pad |
| Supplier Device Package | 24-QFN (3x3) |
| Mounting Type | Surface Mount |
| Packaging | Cut Tape (CT), Tape & Reel (TR) |
Обзор
Description
One of the key features of the ICM-20649 is its high-resolution sensors that offer extended measurement ranges—up to ±4000 degrees per second for the gyroscope and ±30g for the accelerometer. This makes it suitable for high dynamic range applications. The device also includes a Digital Motion Processor (DMP), which offloads computation from the host processor, reducing system power consumption.
The ICM-20649 supports multiple interfaces, including I²C and SPI, facilitating easy integration into various systems. Its low power consumption and small form factor make it ideal for portable and battery-powered applications.
Equivalent
Features
1. High Precision: It offers a wide range of motion sensing capabilities with a 30g accelerometer and a 4000 degrees per second (dps) gyroscope, suitable for high-dynamic applications.
2. DMP Support: Integrated Digital Motion Processor (DMP) for on-chip sensor fusion.
3. Low Power Consumption: Designed for battery-powered devices with configurable power modes to optimize energy use.
4. Low Noise: Provides low noise measurements for both the accelerometer and gyroscope, enhancing performance accuracy.
5. FIFO Buffer: Includes a 4096-byte FIFO buffer to minimize host processor intervention.
6. I2C and SPI Interfaces: Supports both I2C and SPI interfaces for flexible communication with a host processor.
7. Temperature Sensor: An embedded temperature sensor offers thermal compensation and additional environmental monitoring.
8. Compact Package: Available in a small form factor (3x3x0.9 mm LGA package), making it suitable for compact devices.
9. Industry Applications: Widely used in consumer electronics, drones, robotics, and fitness devices.
Pinout
The ICM-20649 comes in a 3 mm x 3 mm x 0.9 mm 14-pin LGA package. Here is a brief overview of its pin functions:
1. VDD - Power supply for the device.
2. VDDIO - Power supply for the I/O interface.
3. GND - Ground.
4. FSYNC - Frame synchronization digital input.
5. INT - Interrupt digital output.
6. SCL - I²C serial clock line or SPI serial clock.
7. SDA/SDI - I²C serial data line or SPI serial data input.
8. SDO - SPI serial data output (can also be used as I²C address select).
9. RESV (x5) - Reserved pins, should be left unconnected or connected as per datasheet instructions.
10. nCS - Chip select for SPI (active low).
These pins provide the necessary interface for communication and operation, supporting both I²C and SPI protocols. Always refer to the specific datasheet for detailed connection and configuration guidelines.
Manufacturer
Application
Package
Frequently Asked Questions
Q: Is the ICM-20649 an obsolete part, and can it still be used in new designs?
A: Yes, its status is Obsolete. It is not recommended for new designs; consider using the manufacturer's newer generation 6-axis IMU.
Q: What communication interfaces does this 6-axis sensor support?
A: It supports both I2C and SPI digital output interfaces for flexible host processor integration.
Q: What is the operating temperature range of the ICM-20649?
A: It operates from -40°C to +85°C, making it suitable for industrial and consumer temperature environments.
Q: What is the package type and size of this IMU?
A: It comes in a 24-VFQFN Exposed Pad module, with a supplier package size of 24-QFN (3x3 mm).
Q: Does this component integrate temperature sensing?
A: Yes, it integrates temperature, accelerometer, and gyroscope sensing in a single 6-axis device.
Q: What mounting method is required for this QFN module?
A: It is designed for Surface Mount (SMD) technology, compatible with standard reflow soldering processes.