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LSM6DS3H
+БОМIMUs - Inertial Measurement Units iNEMO 6DoF inertial module supporting OIS / EIS application
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ПроизводительSTМикроэлектроника
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Мфр. Часть #LSM6DS3H
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Лист данных LSM6DS3H DataSheet
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В наличии17766
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
Обзор
Description
The LSM6DS3H supports multiple power modes to optimize power consumption and performance. It boasts a wide range of functionalities, including programmable interrupts, FIFO memory for batch data processing, and a pedometer feature. With an operating voltage range of 1.71V to 3.6V, it is compatible with various digital communication interfaces like I²C and SPI, providing flexibility in system integration.
This IMU's embedded temperature sensor, alongside the motion sensors, enhances environmental monitoring capabilities. Its small size and versatile features make the LSM6DS3H a popular choice for developers looking to implement precise motion-sensing capabilities in compact electronic devices.
Equivalent
1. Bosch Sensortec BMI160 - A low-power IMU with similar features.
2. Invensense MPU-6050 - A widely used IMU with a comparable feature set.
3. TDK InvenSense ICM-20648 - Offering additional functionalities.
4. Analog Devices ADXL345 + ADXRS620 - A combination for similar sensing capabilities.
These alternatives provide comparable motion sensing and low power consumption characteristics.
Features
1. Low Power Consumption: It supports low-power mode, making it suitable for battery-operated devices.
2. Embedded Functions: The device includes a Machine Learning Core to enable efficient data processing for motion detection, activity recognition, and orientation tracking.
3. High Sensitivity: Offers high-resolution gyroscope and accelerometer outputs for accurate motion detection.
4. Advanced Functionality: Features such as pedometer, tilt detection, step counter, and significant motion detection are integrated.
5. FIFO Buffer: Includes a 9 kB FIFO for efficient data batching and reduced host processor interaction.
6. Temperature Sensor: Built-in temperature sensor for enhanced environmental monitoring.
7. I2C/SPI Interfaces: Supports standard communication interfaces for easy integration with microcontrollers.
8. Compact Design: Small package size, suitable for compact applications such as wearables and smartphones.
Overall, the LSM6DS3H is ideal for applications requiring precise motion tracking and low power usage.
Pinout
The LSM6DS3H comes in a 14-pin LGA (Land Grid Array) package. Here's a brief overview of its pin functions:
1. VDD: Main power supply.
2. VDDIO: I/O pins power supply.
3. GND: Ground.
4. SDA/SDI/SDO: Data line for I2C / Data input for SPI / Data output for SPI.
5. SCL/SPC: Clock line for I2C / Clock input for SPI.
6. CS: Chip select for SPI, active low.
7. INT1: Interrupt output 1.
8. INT2: Interrupt output 2.
9. RESERVED (various pins): Reserved for future use or not connected.
The device is equipped with both I2C and SPI interfaces, allowing easy integration with microcontrollers. The interrupt pins (INT1 and INT2) can be programmed for various functions, including data-ready signals and FIFO threshold interrupts. The LSM6DS3H offers low power consumption and high performance, making it suitable for a range of portable and battery-operated devices.
Manufacturer
Application
1. Wearable Devices: For motion tracking and gesture recognition.
2. Smartphones and Tablets: Enhancing user interface through motion detection.
3. Augmented and Virtual Reality: Providing accurate motion sensing.
4. Drones and Robotics: For stabilization and navigation.
5. Health and Fitness Monitoring: Tracking physical activities and movements.
6. Gaming Devices: Improving interactive gaming experiences through motion sensing.
7. Industrial Automation: For equipment monitoring and predictive maintenance.
8. IoT Devices: Enhancing device interactivity with precise motion data.
Its low power consumption and high precision make it suitable for various applications across consumer electronics and industrial sectors.