MPC8572EVJARLE

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MPC8572EVJARLE

+БОМ

IC MPU MPC85XX 1.067GHZ 1023BGA

  • ПроизводительКомпания NXP USA Inc.

  • Мфр. Часть #MPC8572EVJARLE

  • Пакет BGA1023

  • В наличии7102

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Package Tray
Series MPC85xx
ProductStatus Obsolete
CoreProcessor PowerPC e500
NumberofCores/BusWidth 2 Core, 32-Bit
Speed 1.067GHz
Co-Processors/DSP Signal Processing; SPE, Security; SEC
RAMControllers DDR2, DDR3
GraphicsAcceleration No
Ethernet 10/100/1000Mbps (4)
Voltage-I/O 1.5V, 1.8V, 2.5V, 3.3V
OperatingTemperature 0°C ~ 105°C (TA)
SecurityFeatures Cryptography, Random Number Generator
Package/Case 1023-BBGA, FCBGA

Обзор

Description

The MPC8572EVJARLE is a development system designed for evaluating and developing applications with the Freescale (now NXP) MPC8572 PowerQUICC III processor. This processor is a dual-core, Power Architecture-based embedded processor, optimized for high-performance networking and communications applications. The evaluation board allows developers to explore the capabilities of the processor, which includes features like dual e500 processor cores, high-speed interfaces, and various connectivity options.
The board provides a comprehensive environment for software and hardware development, enabling users to test performance, validate designs, and integrate with other systems. It typically includes interfaces such as Ethernet, PCI Express, serial ports, and memory, allowing versatile testing and development scenarios.
Overall, the MPC8572EVJARLE serves as a crucial tool for engineers and developers to prototype, test, and optimize applications for networking, telecommunications, and other embedded system markets, leveraging the robust capabilities of the MPC8572 processor.

Equivalent

The MPC8572EVJARLE chip, a PowerPC-based processor from NXP (formerly Freescale), can be compared with similar networking-focused processors. Equivalent products might include:
1. NXP's own QorIQ P2020 or P2040 series.
2. Texas Instruments' AM57x series, like AM5728.
3. Broadcom's BCM5301x series.
These alternatives offer comparable performance for embedded and network processing applications, though specific features and compatibility should be reviewed for direct replacements.

Features

The MPC8572EVJARLE is a high-performance processor from NXP's PowerQUICC III family. It features dual e500 cores, based on the Power Architecture technology, operating at speeds up to 1.5 GHz. The processor supports a 45nm SOI process, which enhances performance and power efficiency. It provides high throughput with its integrated L2 cache, DDR2/DDR3 memory controllers, and advanced I/O capabilities.
Key features include:
1. Dual e500 Cores: Offers increased processing capability and parallelism.
2. Memory Support: Includes integrated dual DDR2/DDR3 memory controllers for flexible and high-speed memory access.
3. Networking Capabilities: Comes with multiple Gigabit Ethernet controllers, making it suitable for networking applications.
4. Connectivity: Provides PCI Express, Serial RapidIO, and USB 2.0 interfaces for versatile connectivity options.
5. Security: Equipped with a security engine that supports encryption and decryption standards like AES, DES/3DES, and RSA.
The MPC8572EVJARLE is ideal for networking, telecommunications, and industrial applications, offering a balance of performance, connectivity, and power efficiency.

Pinout

The MPC8572EVJARLE is a microprocessor from Freescale Semiconductor, part of the PowerQUICC III family. It features dual-core Power Architecture e500 cores. The specific pin count for this processor is 1023 pins.
Regarding its functions, the MPC8572E is designed for high-performance networking and communications applications. It supports a range of functionalities such as:
1. Dual-core Processing: It includes two e500 cores, which operate at various frequency options to deliver robust processing power.
2. High-speed Interfaces: It supports multiple high-speed interfaces, including PCI Express, RapidIO, and multiple Gigabit Ethernet controllers, making it suitable for network-intensive applications.
3. Memory Interfaces: The processor includes support for DDR2 and DDR3 memory interfaces, allowing for flexible memory configurations.
4. I/O Capabilities: It offers a rich set of I/O capabilities, catering to complex embedded systems.
5. Power Management: Tailored for energy efficiency, it provides various power management features to optimize power consumption.
These features make the MPC8572E suitable for a wide range of applications, including enterprise networking, telecom, and industrial automation.

Manufacturer

The MPC8572EVJARLE is manufactured by NXP Semiconductors. NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands. It specializes in the design and manufacturing of various semiconductor products, including microcontrollers, processors, and integrated circuits for various applications such as automotive, industrial, IoT, and mobile sectors. The company is known for its focus on innovation and development of secure connectivity solutions for embedded applications.

Application

The MPC8572EVJARLE is a development and evaluation board for the Freescale (now NXP) MPC8572E processor. It is typically used in applications that require high-performance processing and networking capabilities. Common areas include telecommunications infrastructure such as routers and switches, network security appliances, and industrial automation systems. It is also used in aerospace and defense for mission-critical systems due to its reliability and advanced processing abilities. The board supports development for applications involving real-time data processing, complex algorithm execution, and systems requiring robust communication interfaces.

Package

The MPC8572EVJARLE is a part of NXP's QorIQ P Series and it typically comes in a FCBGA (Flip-Chip Ball Grid Array) package. This type of package is used for high-performance processors, providing efficient thermal management and electrical connectivity.

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