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MT41K64M16TW-107:J
+БОМIC DRAM 1GBIT PAR 96FBGA
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ПроизводительКомпания Micron Technology Inc.
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Мфр. Часть #MT41K64M16TW-107:J
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В наличии6121
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Active |
| Base Product Number | MT41K64M16 |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3L |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 933 MHz |
| Voltage - Supply | 1.283V ~ 1.45V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 96-TFBGA |
| Supplier Device Package | 96-FBGA (8x14) |
| Packaging | Tray |
| Access Time | 20 ns |
Обзор
Description
The chip operates at a voltage between 1.35V to 1.5V, allowing for power efficiency. It is equipped with features like on-die termination (ODT), programmable CAS latency, and a fly-by topology for signal integrity and performance improvements. The MT41K64M16TW-107:J is compatible with the JEDEC standard, ensuring interoperability with other DDR3 systems.
Its compact form factor makes it suitable for integration into a wide range of devices, while its high-density configuration is ideal for applications requiring significant memory capacity. Additionally, it is built to operate in various environmental conditions, making it versatile for numerous applications.
Equivalent
Features
1. Density and Configuration: The chip offers a 1Gb density, organized as 64M x 16 bits.
2. Speed and Performance: It supports data rates up to 1866 MT/s, suitable for high-performance computing needs.
3. Voltage: Operates at a standard voltage of 1.5V, with backward compatibility to lower voltage DDR3L devices.
4. Package: It comes in a compact FBGA (Fine-pitch Ball Grid Array) package, optimizing space for module integration.
5. Bank Architecture: Incorporates an 8-bank architecture, allowing efficient parallel processing and improved data access speeds.
6. Temperature Range: Designed to operate efficiently across a wide temperature range, making it suitable for various applications, from consumer electronics to industrial systems.
7. Additional Features: Includes self-refresh, auto precharge, and on-chip temperature sensor for enhanced reliability and power efficiency.
This combination of features makes it a versatile choice for upgrading or designing memory solutions in a variety of computing environments.
Pinout
Key functions of the MT41K64M16TW-107:J include:
1. Data Storage and Retrieval: It provides a storage capacity of 1GB (8Gb), organized as 64M x 16 bits, suitable for storing data temporarily for processing tasks in computing devices.
2. High-Speed Data Transfer: Supports data rates of up to 1866 MT/s (megatransfers per second), ensuring efficient data handling and quick access times.
3. Low Power Consumption: Operates at a low voltage of 1.35V, helping to reduce the overall power consumption of devices.
4. Reliable Performance: Employs advanced timing features and error correction to ensure data integrity and reliable performance in demanding environments.
Overall, the MT41K64M16TW-107:J is suitable for a broad range of applications in computing and consumer electronics where high performance and low power usage are critical.
Manufacturer
Micron is recognized as one of the leading companies in the semiconductor industry, with a focus on delivering high-performance and innovative memory technologies. Their products are used in various applications, ranging from consumer electronics, computing, mobile devices, and automotive to networking and data centers. As a company, Micron is committed to advancing memory technology to meet the growing demands for data processing and storage in the modern digital world.
Application
1. Consumer Electronics: Used in devices like smartphones, tablets, and digital cameras for efficient data processing and storage.
2. Computing: Integrated into laptops, desktops, and servers for enhanced memory performance.
3. Networking: Utilized in routers, switches, and other networking devices to handle data-intensive operations.
4. Embedded Systems: Applied in industrial and automotive electronics for reliable memory solutions.
Its low power consumption and high-speed data transfer capabilities make it suitable for diverse applications requiring efficient memory management.
Package
Frequently Asked Questions
Q: What is the memory density and organization of this DDR3L SDRAM?
A: It is a 1Gbit DRAM organized as 64M words by 16 bits, suitable for parallel interface memory applications.
Q: What voltage supply range does this device require?
A: It operates with a supply voltage range of 1.283V to 1.45V, compliant with DDR3L low-voltage standards.
Q: What is the maximum clock frequency and access time?
A: It supports a clock frequency of 933 MHz with a typical access time of 20 ns, enabling high-speed data transfer.
Q: What is the operating temperature range for this component?
A: It is rated for an operating temperature range from 0°C to 95°C (TC), suitable for industrial or commercial environments.
Q: Is this memory volatile or non-volatile, and what technology is used?
A: It is volatile DDR3L SDRAM, meaning data is lost when power is removed; ideal for temporary data storage in computing systems.
Q: What is the packaging form and mounting type for this part?
A: It comes in a 96-TFBGA package with surface mount mounting, specifically in a 96-FBGA (8x14) supplier device package and supplied in tray packaging.