MX30LF4G18AC-TI

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MX30LF4G18AC-TI

+БОМ

IC FLASH 4GBIT PARALLEL 48TSOP

  • ПроизводительМакроникс

  • Мфр. Часть #MX30LF4G18AC-TI

  • Лист данных MX30LF4G18AC-TI DataSheet

  • В наличии2942

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Спецификации

Атрибут Ценность
Series MX30LF
Part Status Not For New Designs
Base Product Number MX30LF4
DigiKey Programmable Not Verified
Memory Type Non-Volatile
Memory Format FLASH
Technology FLASH - NAND (SLC)
Memory Size 4Gbit
Memory Organization 512M x 8
Memory Interface Parallel
Write Cycle Time - Word, Page 20ns
Voltage - Supply 2.7V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 48-TFSOP (0.724", 18.40mm Width)
Supplier Device Package 48-TSOP
Packaging Tray
Access Time 20 ns

Обзор

Description

The MX30LF4G18AC-TI is a NAND Flash memory device produced by Macronix, designed for use in a variety of digital applications. This memory chip offers a storage capacity of 4 gigabits and features an interface that supports asynchronous data transfer, making it suitable for applications requiring substantial data storage with moderate speed requirements.
The device follows the industry-standard NAND Flash protocol, ensuring compatibility with existing hardware and software systems. It operates at a voltage range of 2.7V to 3.6V, making it energy-efficient for battery-operated devices. The chip includes features like wear leveling, error correction code (ECC) support, and bad block management to enhance data integrity and lifespan.
Its package type is typically a 48-pin TSOP or LGA, aiding in compact device design. The MX30LF4G18AC-TI is well-suited for use in consumer electronics, industrial applications, and any systems requiring reliable, high-capacity storage. It is also RoHS compliant, ensuring it meets environmental standards for hazardous substances.

Equivalent

Equivalent products to the MX30LF4G18AC-TI chip, which is a NAND Flash memory, include:
1. Micron MT29F4G08ABAEAWP: 4Gb NAND Flash with similar specifications.
2. Samsung K9F4G08U0D: A compatible 4Gb NAND Flash option.
3. Toshiba TC58NVG2S0H: Another 4Gb NAND Flash alternative.
4. Winbond W29N04GVSIAA: A 4Gb NAND Flash with comparable features.
These products are potential substitutes based on memory capacity and interface compatibility. Always verify exact specifications for full compatibility.

Features

The MX30LF4G18AC-TI is a NAND Flash memory chip by Macronix, featuring a 4Gb (Gigabit) storage capacity. It is organized with an x8 interface and is typically used in embedded applications where high-density storage is required. Key features include:
1. Interface: SLC (Single-Level Cell) NAND architecture with an ONFI (Open NAND Flash Interface) interface for compatibility and ease of integration.
2. Performance: It offers high-speed read and write operations, suitable for performance-critical applications.
3. Reliability: Includes features like ECC (Error Correction Code) to enhance data integrity and reliability.
4. Endurance: Capable of withstanding a high number of program/erase cycles, typical for SLC NAND Flash.
5. Voltage: Operates at a standard 3.3V supply voltage.
6. Package: Available in a TSOP (Thin Small Outline Package) for compactness and easy mounting on PCBs (Printed Circuit Boards).
7. Temperature Range: Designed to function efficiently across a wide temperature range, supporting industrial applications.
These features make the MX30LF4G18AC-TI well-suited for a variety of storage applications in consumer, industrial, and automotive sectors.

Pinout

The MX30LF4G18AC-TI is a NAND Flash Memory chip manufactured by Macronix. It features a 48-pin TSOP (Thin Small Outline Package) layout. This flash memory is organized in a configuration that typically includes a range of pins for power, ground, and data interface.
Key functions and pin assignments generally include:
1. Data I/O Pins: These pins are used for input and output operations (I/O0 to I/O15), facilitating data transfer between the NAND flash and the host.
2. Control Pins:
- CE# (Chip Enable): Activates the chip.
- RE# (Read Enable): Controls the data output during read operations.
- WE# (Write Enable): Allows data to be written to the memory.
- CLE (Command Latch Enable): Used for command input.
- ALE (Address Latch Enable): Used for address input.
3. Power Pins:
- VCC: Power supply.
- VSS: Ground.
4. WP# (Write Protect): Protects the device from write operations.
5. R/B# (Ready/Busy): Indicates the operating status of the device.
These pins work together to facilitate the memory operations of storing and retrieving data.

Manufacturer

The MX30LF4G18AC-TI is manufactured by Macronix International Co., Ltd. Macronix is a leading provider in the non-volatile memory market, specializing in NOR Flash, NAND Flash, and ROM products. The company, headquartered in Hsinchu, Taiwan, is known for its innovation and high-quality memory solutions, catering to a wide range of industries including automotive, consumer, networking, and industrial applications. As a key player in the semiconductor industry, Macronix focuses on research and development to advance memory technologies and meet the evolving demands of its global customer base.

Application

The MX30LF4G18AC-TI is a NAND Flash memory chip commonly used in various applications that require reliable data storage. Typical application areas include consumer electronics like smartphones, tablets, and digital cameras, where it provides storage for media and applications. It's also used in industrial systems for logging data and firmware storage, embedded systems for boot and data storage, and automotive applications for infotainment systems and data logging. Additionally, the chip is suitable for networking devices and other IoT hardware, offering efficient and compact data storage solutions.

Package

The MX30LF4G18AC-TI is a NAND Flash memory chip produced by Macronix. It comes in a 63-ball Ball Grid Array (BGA) package, which is compact and suitable for high-density memory applications. This package type supports efficient thermal and electrical performance, making it ideal for consumer electronics and computing devices.

Frequently Asked Questions


Q: What is the memory capacity and organization of the MX30LF4G18AC-TI?
A: It offers 4Gbit (512M x 8) NAND Flash memory, organized as 512 Megabyte words with an 8-bit parallel interface.


Q: What is the voltage supply range for this component?
A: The device operates within a supply voltage range of 2.7V to 3.6V, making it suitable for standard 3.3V systems.


Q: Is this a NAND or NOR Flash, and what type of cell is used?
A: It is a NAND Flash memory using SLC (Single-Level Cell) technology, offering high reliability and fast read/write performance.


Q: What is the access time and write cycle time for this part?
A: The access time is 20 ns, while the write cycle time for a word or page is also 20 ns.


Q: What package does the MX30LF4G18AC-TI come in?
A: It is supplied in a 48-TFSOP package (0.724", 18.40mm Width) with a supplier device package of 48-TSOP, suitable for surface mount assembly.


Q: What is the operating temperature range for this memory IC?
A: The industrial temperature range is -40°C to +85°C (TA), enabling use in harsh environments.


Q: Is the MX30LF4G18AC-TI recommended for new designs?
A: No, its part status is "Not For New Designs," so it is more suitable for existing production or replacement needs.


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