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MX77L12850FM2I40
+БОМIC FLASH 128MBIT SPI/QUAD 8SOP
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ПроизводительМакроникс
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Мфр. Часть #MX77L12850FM2I40
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В наличии8978
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Series | MXSMIO™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Memory Size | 128Mbit |
| Memory Organization | 32M x 4, 64M x 2, 128M x 1 |
| Memory Interface | SPI - Quad I/O |
| Clock Frequency | 104 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 8-SOIC (0.209", 5.30mm Width) |
| Technology | FLASH - NOR (SLC) |
| Write Cycle Time - Word, Page | 50µs, 1.2ms |
| Supplier Device Package | 8-SOP |
| Access Time | 6 ns |
Обзор
Description
This particular model number suggests a high level of specificity, possibly indicating a part used in specialized fields such as telecommunications, computing, or industrial systems. The alphanumeric sequence might denote its family series, memory capacity, operational speed, or temperature rating, which are critical for engineers and designers when selecting components for system requirements.
For detailed technical information, it is advisable to refer to the manufacturer's datasheet or technical documentation, which would provide insights into electrical characteristics, pin configuration, operational guidelines, and application notes essential for integration into electronic systems. If you're involved in designing or troubleshooting systems using this component, access to such detailed documentation is crucial.
Equivalent
Features
1. Capacity/Storage: Refers to the amount of data it can handle if it is a memory product.
2. Speed: Measured in MHz or GHz, indicating how fast it processes or transfers data.
3. Voltage: The operating voltage range for efficient functionality.
4. Temperature Range: Operational temperature limits, ensuring reliability under different environmental conditions.
5. Interface: Type of connectivity, such as PCIe, SATA, or DDR for memory.
6. Package Type: Physical dimensions and pin configurations for board integration.
7. Use Case: Specific applications it is designed for, like automotive, industrial, or consumer electronics.
For exact specifications, consulting the manufacturer's datasheet or product documentation is recommended.