TPSM63610EXTRDFR

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TPSM63610EXTRDFR

+БОМ

HIGH-DENSITY, 36-V INPUT, 1-V TO

  • ПроизводительТехасские инструменты

  • Мфр. Часть #TPSM63610EXTRDFR

  • В наличии3703

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Series HotRod™
PartStatus Active
Type Non-Isolated PoL Module
NumberofOutputs 1
Voltage-Input(Min) 3V
Voltage-Input(Max) 36V
Voltage-Output1 1 ~ 20V
Current-Output(Max) 8A
Applications ITE (Commercial)
Features Adjustable Output, Remote On/Off
OperatingTemperature -55°C ~ 125°C
Efficiency 94.3%
MountingType Surface Mount
Package/Case 22-PowerBQFN Module
Size/Dimension 0.30" L x 0.26" W x 0.16" H (7.5mm x 6.5mm x 4.0mm)
SupplierDevicePackage 22-B3QFN (6.5x7.5)
ControlFeatures Enable, Active High

Обзор

Description

The TPSM63610EXTRDFR is a power module designed by Texas Instruments. It is primarily used for applications requiring efficient voltage regulation. The module integrates a synchronous step-down converter, which simplifies power supply design by combining the controller, inductor, and other necessary components into a single package. This integration reduces the need for external components, saving space and simplifying PCB layout.
Key features of the TPSM63610EXTRDFR include high efficiency, wide input voltage range, and the ability to deliver up to 10 A output current. It's designed to operate in harsh environments, thanks to its robust thermal performance and protection features like overcurrent, overvoltage, and thermal shutdown. The module is suitable for industrial, automotive, and telecom applications where reliable power delivery is crucial.
Additionally, its compact size and advanced packaging technology allow for high-density power solutions, making it ideal for space-constrained applications. Overall, the TPSM63610EXTRDFR offers a balance of performance, reliability, and ease of use.

Equivalent

The TPSM63610EXTRDFR is a step-down power module from Texas Instruments. Equivalent products could include:
1. LMZM33606 from Texas Instruments: A similar step-down power module.
2. LTM4622 from Analog Devices: A comparable micro-module regulator.
3. MPM3695 from Monolithic Power Systems: Another step-down power module.
Ensure to compare specifications like input voltage range, output current, and other features to confirm equivalency for your specific application.

Features

The TPSM63610EXTRDFR is a high-performance power module from Texas Instruments designed for efficient voltage regulation. Key features include:
1. Input Voltage Range: Operates efficiently with a wide input voltage range, typically from 3.8V to 36V, making it versatile for various applications.
2. Output Current: Capable of delivering up to 1A of continuous output current, suitable for low to medium power applications.
3. Efficiency: Designed for high efficiency across a broad load range, which helps minimize power loss and heat generation.
4. Size and Package: Comes in a compact QFN package, facilitating ease of integration into space-constrained designs.
5. Protection Features: Includes built-in protection mechanisms like overcurrent protection, thermal shutdown, and undervoltage lockout to ensure reliable operation.
6. Thermal Performance: Enhanced thermal management for better reliability and performance in demanding environments.
7. Applications: Suitable for applications such as industrial, automotive, and communications equipment where stable and efficient power supply is crucial.
These features make the TPSM63610EXTRDFR a robust solution for power management needs in various electronic designs.

Pinout

The TPSM63610EXTRDFR is a power module by Texas Instruments. It typically comes in a small footprint package designed for efficient power management applications.
1. Pin Count: The TPSM63610EXTRDFR has a total of 13 pins.
2. Function: This module is a step-down (buck) converter designed to provide efficient power conversion. It is capable of delivering up to 10 A of output current. This device integrates a power inductor and a shielded inductor, minimizing noise and enhancing performance. It supports a wide input voltage range and offers features like adjustable switching frequency, soft start, undervoltage lockout, and overcurrent protection. These functionalities make it suitable for use in applications requiring robust power management, such as industrial, telecom, and general-purpose power designs.
For detailed electrical characteristics and specific functions of each pin, consulting the datasheet is recommended.

Manufacturer

The TPSM63610EXTRDFR is manufactured by Texas Instruments (TI). Texas Instruments is a global technology company that designs and manufactures semiconductors and various integrated circuits, which are used in electronic devices across a wide range of industries. TI is particularly known for its analog chips, embedded processors, and digital signal processors, serving sectors such as automotive, industrial, personal electronics, communications equipment, and enterprise systems. The company is renowned for its focus on innovation, quality, and support, making it a leading player in the semiconductor industry.

Application

The TPSM63610EXTRDFR is a power module primarily used in applications requiring efficient power management and voltage regulation. Key application areas include industrial automation equipment, telecommunications, test and measurement systems, and automotive electronics. It is particularly suitable for systems that need a compact, reliable, and high-performance power supply solution. The module's capability to handle wide input voltage ranges and deliver high current makes it ideal for use in distributed power systems, embedded computing, and edge devices. Its efficiency and thermal performance also make it a good choice for battery-powered or energy-sensitive applications.

Package

The TPSM63610EXTRDFR is a power module from Texas Instruments. It comes in a compact and thermally efficient QFN (Quad Flat No-leads) package, specifically designed for high-density applications. This package type allows for efficient heat dissipation and is suitable for applications with space constraints, offering ease of use with integrated components.

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