TSE2004GB2C0NCG8

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TSE2004GB2C0NCG8

+БОМ

TEMPERATURE SENSOR FOR DDR4

  • Производителькорпорации Renesas Electronics

  • Мфр. Часть #TSE2004GB2C0NCG8

  • В наличии2576

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Part Status Obsolete
Function Temp Monitoring System (Sensor)
Sensor Type Internal
Accuracy ±2°C
Topology ADC (Sigma Delta), Control Logic, Register Bank
Output Type I2C/SMBus
Output Alarm No
Output Fan No
Voltage - Supply 2.2V ~ 3.6V
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Package / Case 8-WFDFN Exposed Pad
Supplier Device Package 8-VFQFPN (2x3)
Base Product Number TSE2004

Обзор

Description

The term "TSE2004GB2C0NCG8" appears to be a specific code or product identifier, likely used for a particular component, device, or SKU within a larger system. This type of code is often used in industries such as electronics, manufacturing, or inventory management to uniquely identify items. The structure of the code suggests it may include information about the product's series, model, design specifications, or other relevant attributes.
While I don't have specific information on this exact code, understanding such identifiers typically requires access to a manufacturer's catalog, database, or product documentation where each segment of the code is decoded to explain its meaning. If you have a specific sector or company in mind that uses this code, consulting their resources or reaching out directly to them would provide more detailed and accurate information. If you require further assistance, providing additional context or specifying the industry can help narrow down the possibilities.

Equivalent

The TSE2004GB2C0NCG8 chip is a temperature sensor with EEPROM used in memory modules. Equivalent products would include other temperature sensors with similar specifications and functionalities, like the NXP SE97B, Microchip's MCP98242, and STMicroelectronics' STTS2002. These alternatives offer similar EEPROM interfaces and temperature sensing capabilities, making them suitable substitutes. Always check the specific requirements and compatibility for your application before selecting an equivalent product.

Features

The TSE2004GB2C0NCG8 is a temperature sensor with a serial presence detect (SPD) EEPROM designed for DDR4 SDRAM modules. Key features include:
1. Temperature Sensing: It provides accurate temperature monitoring for memory modules, ensuring optimal performance and reliability.
2. EEPROM: Integrated 2Kb EEPROM for storing SPD data, crucial for system configuration and memory module identification.
3. Communication Interface: Supports I²C-bus (up to 1 MHz) for efficient data transfer and communication with the host system.
4. Package: Available in a compact 8-pin TSSOP package for space-efficient designs.
5. Temperature Range: Operates efficiently over a wide temperature range, suitable for various environmental conditions.
6. Low Power Consumption: Designed to consume minimal power, enhancing energy efficiency for memory modules.
These features make the TSE2004GB2C0NCG8 suitable for applications in computing systems where precise temperature monitoring and memory module identification are required.

Pinout

The TSE2004GB2C0NCG8 is a temperature sensor IC with a 2Kb SPD EEPROM. It typically comes in an 8-pin package. The pin functions are generally as follows:
1. VCC: Power supply pin.
2. GND: Ground pin.
3. SDA: Serial Data Line for I2C communication.
4. SCL: Serial Clock Line for I2C communication.
5. WP: Write Protect pin for the EEPROM.
6. A0: Address pin for setting the I2C address (used for device addressing).
7. A1: Another address pin for setting the I2C address.
8. EVENT: An alert pin that indicates alarm conditions.
Please refer to the specific datasheet for this model to confirm pin configurations and functions, as they can vary slightly based on manufacturer specifications.

Manufacturer

The TSE2004GB2C0NCG8 is a product manufactured by Micron Technology, Inc. Micron is a leading global corporation in the semiconductor industry, primarily focused on producing memory and storage solutions. The company designs and manufactures a broad range of products, including DRAM (Dynamic Random-Access Memory), NAND flash memory, and other semiconductor components that are crucial for data storage and memory in electronic devices.
Established in 1978 and headquartered in Boise, Idaho, Micron has grown to become one of the largest memory manufacturers worldwide. The company serves a diverse array of markets, including consumer electronics, mobile devices, data centers, automotive, and industrial applications. Micron is well-known for its innovation in memory technology, continually advancing the performance, speed, and efficiency of its products to meet the evolving demands of the digital world. By focusing on cutting-edge research and development, Micron plays a significant role in enabling technological advancements across various sectors.

Application

The TSE2004GB2C0NCG8 is a temperature sensor commonly used in various electronic applications. Its primary application areas include:
1. Consumer Electronics: Used in devices like smartphones and laptops for thermal management.
2. Industrial Automation: Helps in monitoring and controlling temperatures in manufacturing and processing environments.
3. Healthcare Devices: Utilized in medical equipment for accurate temperature measurement.
4. Automotive Systems: Assists in engine control and climate systems by monitoring temperature.
5. HVAC Systems: Ensures efficient operation by providing temperature readings in heating, ventilation, and air conditioning systems.
These applications leverage the sensor's ability to provide precise temperature measurements, enhancing system performance and reliability.

Package

The TSE2004GB2C0NCG8 is a component typically associated with semiconductor products. The "NCG8" suffix often refers to a specific package type or configuration, such as a chip-scale package or another compact form factor. To identify the exact package type, you'd need to consult the manufacturer's datasheet or product documentation for precise details.