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W63AH2NBVADE
+БОМIC DRAM 1GBIT HSUL 12 178VFBGA
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Производителькомпанией Winbond Electronics
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Мфр. Часть #W63AH2NBVADE
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Лист данных W63AH2NBVADE DataSheet
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В наличии10910
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Active |
| Digi Key Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Memory Size | 1Gbit |
| Memory Organization | 32M x 32 |
| Memory Interface | HSUL_12 |
| Clock Frequency | 1.066 GHz |
| Voltage - Supply | 1.14V ~ 1.3V, 1.7V ~ 1.95V |
| Operating Temperature | -25°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
| Package / Case | 178-VFBGA |
| Base Product Number | W63AH2 |
| Technology | SDRAM - Mobile LPDDR3 |
| Write Cycle Time - Word, Page | 15ns |
| Supplier Device Package | 178-VFBGA (11x11.5) |
Обзор
Description
Equivalent
Features
1. Capacity: Generally designed to handle medium to large laundry loads.
2. Energy Efficiency: Likely adheres to contemporary standards for energy saving.
3. Wash Programs: Multiple settings for different fabric types and soil levels.
4. Spin Speed: Variable spin speeds to reduce drying time.
5. Smart Features: Possible connectivity options for remote operation via a smartphone app.
6. Noise Reduction: Designed to operate quietly.
7. Water Efficiency: Incorporates technology to minimize water use.
8. Build: Durable materials for long-term use.
9. User Interface: Easy-to-use digital controls or touchscreen.
For the precise features, it’s best to consult the product manual or the manufacturer's website.
Pinout
Key features and functions of the W63AH2NBVADE include:
1. Pin Count: 200-ball FBGA.
2. Data Rate: High-speed data transfer capabilities with lower power consumption compared to older LPDDR standards.
3. Voltage: Operates at a lower voltage than traditional DDR memory, which helps in reducing power consumption.
4. Density: Provides high-density memory configurations suitable for mobile devices, tablets, and other compact electronics.
5. Compatibility: Adheres to JEDEC standards, ensuring compatibility with a wide range of processors and devices.
For detailed pin functions, consult the specific datasheet from Winbond as it will provide comprehensive information regarding each pin's role in the device's operation.