XC7A50T-2CSG324I

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XC7A50T-2CSG324I

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IC FPGA 210 I/O 324CSBGA

  • ПроизводительAMD Xilinx компанией

  • Мфр. Часть #XC7A50T-2CSG324I

  • Пакет CSBGA-324

  • В наличии7123

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Спецификации

Атрибут Ценность
Package Tray
Series Artix-7
ProductStatus Active
NumberofLABs/CLBs 4075
NumberofLogicElements/Cells 52160
TotalRAMBits 2764800
NumberofI/O 210
Voltage-Supply 0.95V ~ 1.05V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Обзор

Description

The XC7A50T-2CSG324I is a mid-range Artix-7 FPGA from Xilinx (now AMD), featuring:
- 52,160 logic cells
- 2,850 Kb block RAM
- 120 DSP slices
- 200 MHz max clock speed
- 324-pin CSG package (0.5mm pitch, BGA)
Built on 28nm process technology, it balances performance, power efficiency, and cost, making it ideal for embedded systems, industrial controls, and communications. Key interfaces include Gigabit Ethernet, PCIe Gen2, and GPIO.
The -2 speed grade ensures moderate performance, while the industrial (-I) temperature range (–40°C to +100°C) suits harsh environments.
Typical applications: motor control, IoT, and low-power signal processing. Requires Vivado Design Suite for development.

Equivalent

The XC7A50T-2CSG324I, a mid-range Artix-7 FPGA, has equivalents like:
- Xilinx Artix-7 family: XC7A35T, XC7A75T (lower/higher logic density).
- Competitors:
- Intel (Altera): Cyclone V 5CEA2/5CEA4 (similar logic/resources).
- Lattice Semiconductor: ECP5-25/45 (lower power, smaller footprint).
- Alternate packages: XC7A50T in different speed grades or packages (e.g., XC7A50T-1CSG324C).
Check datasheets for exact specs.

Features

The XC7A50T-2CSG324I is a mid-range Artix-7 FPGA from Xilinx (now AMD). Key features:
- Logic Cells: 52,160
- DSP Slices: 120
- Block RAM: 2,700 Kb (2700 × 1Kb)
- I/O Pins: 210 (supports LVDS, LVCMOS, etc.)
- Package: CSG324 (324-ball BGA, 0.8mm pitch)
- Speed Grade: -2 (moderate performance)
- Operating Temp: Industrial (-40°C to +100°C)
- Transceivers: None (Artix-7 A50T lacks GTP/GTX)
- Power: Low static/dynamic power (28nm HPL process)
Ideal for embedded, industrial, and cost-sensitive applications requiring moderate logic density.

Pinout

The XC7A50T-2CSG324I is a 324-pin FPGA from Xilinx's Artix-7 family, packaged in a CSG324 (0.5mm pitch, 15x15mm) ball grid array (BGA).
Key functions:
- Logic resources: ~52,160 LUTs, 4,050 Kb block RAM, 120 DSP slices.
- I/O pins: 150+ user I/Os (supports LVDS, LVCMOS, etc.).
- High-speed interfaces: GTP transceivers (up to 6.6 Gbps), PCIe Gen2 support.
- Clocking: Multiple clock management tiles (CMTs) for PLL/DLL.
- Power: 1.0V core voltage, supports low-power operation.
Designed for cost-sensitive, high-performance applications like embedded vision, motor control, and communications.

Manufacturer

The XC7A50T-2CSG324I is manufactured by Xilinx, now part of AMD after its acquisition in 2022.
Xilinx is a leading semiconductor company specializing in field-programmable gate arrays (FPGAs), adaptive SoCs, and related development tools. The XC7A50T belongs to the Artix-7 family, known for low power and cost efficiency, targeting embedded, industrial, and consumer applications.
AMD (Advanced Micro Devices) is a global semiconductor firm known for CPUs, GPUs, and adaptive computing solutions. The Xilinx integration strengthens AMD's high-performance and adaptive computing portfolio.

Application

The XC7A50T-2CSG324I, a mid-range Artix-7 FPGA from Xilinx (now AMD), is widely used in:
1. Embedded Systems – Industrial automation, motor control, and robotics.
2. Communications – Software-defined radio (SDR), networking, and baseband processing.
3. Consumer Electronics – HD video processing, drones, and gaming.
4. Automotive – ADAS, infotainment, and sensor fusion.
5. Aerospace & Defense – Radar, avionics, and secure communications.
Its low power, high performance, and compact 324-pin CSP package make it ideal for cost-sensitive, space-constrained applications.

Package

The XC7A50T-2CSG324I is a Field-Programmable Gate Array (FPGA) from Xilinx's Artix-7 family. It comes in a CSG324 package, which is a 324-ball Chip-Scale Ball Grid Array (CSBGA) with a 0.8mm ball pitch. This package is compact, surface-mountable, and suitable for space-constrained applications. The "I" suffix indicates an industrial temperature range (-40°C to +100°C).

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