10M40DCF672C8G
Интель
- Lifecycle
- Active
- Stock
- 5081 ПКС
- Package
- BGA-672
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Это подробное сравнение 10M40DCF672C8G и 10M40DAF672C7G предоставляет ценную информацию об их технических характеристиках и ключевых особенностях. Мы подробно рассматриваем важные факторы, включая соответствие требованиям RoHS, статус REACH, серию, способ монтажа, тип корпуса и другие соответствующие характеристики. Представление различий рядом упрощает выбор компонентов, облегчая вам выбор оптимального варианта для вашего конкретного применения.
Replacement verdict
The 10M40DCF672C8G and 10M40DAF672C7G are both Intel MAX 10 FPGA devices sharing the same 40K logic element density and 672-pin FBGA package, making them functionally interchangeable in most designs. The primary distinction lies in speed grade and operating temperature range, which may affect timing closure and thermal margins in demanding applications. Designers should validate timing performance and thermal requirements before committing to a direct substitution.
Интель
Интель
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DAF672C7G | Why it matters |
|---|---|---|---|
| Family / Series | MAX 10 | MAX 10 | Both devices belong to the same Intel MAX 10 FPGA family, which is the baseline requirement for functional substitutability. |
| Logic Elements (LEs) | 40,000 | 40,000 | Identical logic density means both parts can implement the same logic design without resource constraints. |
| Package | 672-pin FBGA | 672-pin FBGA | Matching package and pin count ensures the parts are physically interchangeable on the same PCB footprint. |
| Operating Temperature Range | Commercial (0°C to 85°C) | Industrial (-40°C to 100°C) | The industrial-grade version supports harsher environments, so substitution depends on the target application's thermal requirements. |
| Speed Grade | 8 (faster) | 7 (slower) | Different speed grades affect maximum operating frequency and timing closure, which can impact whether a design meets its performance targets. |
| Embedded Memory | 1,260 Kbits | 1,260 Kbits | Identical embedded memory capacity ensures both devices can support the same on-chip buffering and storage requirements. |
| 18x18 Multipliers | 126 | 126 | Equal DSP resources mean both parts can handle the same arithmetic-intensive functions such as filtering and signal processing. |
| User I/O Pins | 500 | 500 | Matching I/O count ensures both devices can interface with the same number of external peripherals and signals. |
| Configuration Flash | Integrated (single-chip) | Integrated (single-chip) | Both devices feature on-chip configuration flash, eliminating the need for external configuration memory and simplifying board design. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Identical core voltage requirements mean the same power supply design can be used for either device. |
Send your BOM and application constraints for technical and sourcing review.
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DAF672C7G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 500 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M40 density tier, featuring 40,000 logic elements (LEs), non-volatile integrated flash configuration, and a 672-pin FineLine BGA (FBGA) package. The 10M40DCF672C8G is specified with a commercial temperature grade and speed grade 8, while the 10M40DAF672C7G is specified with an automotive temperature grade and speed grade 7.
The primary differences are the temperature grade and speed grade. The 10M40DCF672C8G uses the "C" designator for commercial temperature range and speed grade 8. The 10M40DAF672C7G uses the "A" designator for automotive temperature range and speed grade 7. Both share the same 10M40 die, 40,000 LE density, and 672-pin FBGA package.
Yes. Both devices use the same 672-pin FineLine BGA (FBGA) package with the same pinout defined by the MAX 10 device family. The package footprint and pin functions are identical, so they are pin-compatible when the PCB is designed for the 672-pin FBGA land pattern.
Not automatically. Although they are pin-compatible, the 10M40DAF672C7G has an automotive temperature grade and a different speed grade (7) than the 10M40DCF672C8G (commercial, speed grade 8). Timing closure, operating temperature range, and any automotive qualification requirements must be revalidated against the target design before substitution.
Both the 10M40DCF672C8G and 10M40DAF672C7G are 10M40 devices with 40,000 logic elements (LEs). They include embedded M9K memory blocks and user flash memory (UFM) as part of the MAX 10 architecture. For exact M9K block counts and total RAM bits, refer to the Intel MAX 10 device datasheet for the 10M40 density.
Yes. MAX 10 FPGAs, including the 10M40DCF672C8G and 10M40DAF672C7G, feature integrated non-volatile flash configuration memory, which enables instant-on operation and eliminates the need for an external configuration device in many designs.
The 10M40DCF672C8G carries the commercial "C" temperature grade, and the 10M40DAF672C7G carries the automotive "A" temperature grade. Exact junction and ambient temperature limits should be confirmed from the Intel MAX 10 device datasheet and the specific ordering code documentation.
The 10M40DAF672C7G is the appropriate choice for automotive applications because its ordering code includes the automotive temperature grade designator. The 10M40DCF672C8G is intended for commercial-grade applications. Final selection must also account for speed grade, qualification requirements, and design timing.