Part A
10M40DCF672C8G
Интель
- Lifecycle
- Active
- Stock
- 5081 ПКС
- Package
- BGA-672
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 10M40DCF672C8G and 10M40DAF672C8G are functionally equivalent Intel MAX 10 FPGA devices sharing the same logic density, package, speed grade, and operating temperature range. The only difference is the integrated configuration flash feature, making the 10M40DAF672C8G a viable alternative where active serial configuration is not required.
Logic Density
High match
Package Type
High match
Operating Temperature
High match
Configuration Flash
Validation required
Parts at a glance
Part B
10M40DAF672C8G
Интель
- Lifecycle
- Active
- Stock
- 5441 ПКС
- Package
- BGA-672
- Series
- Встроенные - FPGA (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 10M40DCF672C8G | 10M40DAF672C8G | Why it matters |
|---|---|---|---|
| Family | Intel MAX 10 FPGA | Intel MAX 10 FPGA | Both parts belong to the same device family, so they share the same architecture, toolchain, and IP support. |
| Logic Elements (LEs) | 40,000 | 40,000 | Identical logic capacity means equivalent ability to implement user logic and IP blocks. |
| Embedded Memory | 1,260 Kbits | 1,260 Kbits | Matching on-chip memory supports the same buffering, FIFO, and data storage requirements. |
| 18x18 Multipliers | 288 | 288 | Equal DSP resources allow the same signal processing and arithmetic workloads. |
| Package | 672-pin FBGA | 672-pin FBGA | Same package and pin count enable a common PCB footprint and mechanical compatibility. |
| Operating Temperature Range | 0°C to 85°C (Commercial) | 0°C to 85°C (Commercial) | Identical temperature grade ensures the same environmental operating envelope. |
| Configuration Method | Dual Configuration (dual-boot image support) | Single Configuration (flash-based) | Dual configuration allows fail-safe updates and fallback images, while single configuration offers only one stored image, affecting boot flexibility and reliability. |
| Configuration Flash | Integrated | Integrated | Both devices include on-die configuration flash, eliminating the need for external configuration memory. |
| Supply Voltage (Core) | 1.2 V | 1.2 V | Same core voltage means identical power supply design and decoupling requirements. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 10M40DCF672C8G | 10M40DAF672C8G |
|---|---|---|
| Supplier | - | Intel |
| Series | MAX® 10 | MAX® 10 |
| Part Status | Active | Active |
| Number of LABs/CLBs | 2500 | 2500 |
| Number of Logic Elements/Cells | 40000 | 40000 |
| Total RAM Bits | 1290240 | 1290240 |
| Number of I/O | 500 | 500 |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) | 0°C ~ 85°C (TJ) |
Frequently asked questions
What are the 10M40DCF672C8G and 10M40DAF672C8G devices?
Both are Intel (formerly Altera) MAX 10 field-programmable gate arrays (FPGAs) in the 10M40 density grade, featuring 40,000 logic elements (LEs), non-volatile integrated flash configuration, and a 672-pin FineLine BGA (FBGA) package. The 10M40DCF672C8G and 10M40DAF672C8G differ in their specified operating temperature grade and corresponding ordering suffix.
What is the difference between the 10M40DCF672C8G and 10M40DAF672C8G?
The primary difference is the temperature grade indicated by the ordering code suffix. The 10M40DCF672C8G is specified for the commercial temperature range (typically 0°C to 85°C junction), while the 10M40DAF672C8G is specified for the industrial temperature range (typically -40°C to 100°C junction). Both share the same 40,000-LE density, 672-pin FBGA package, and MAX 10 device family features.
Are the 10M40DCF672C8G and 10M40DAF672C8G pin-compatible?
Yes. Both devices use the same 672-pin FineLine BGA (FBGA) package with identical pinouts as defined by the MAX 10 device family. The package footprint and pin assignments are the same; the difference is limited to the temperature grade specification and ordering code.
Can the 10M40DCF672C8G be used as a substitute for the 10M40DAF672C8G?
Substitution depends on the target application's temperature requirements. The 10M40DAF672C8G is rated for the industrial temperature range, while the 10M40DCF672C8G is rated for the commercial range. A commercial-grade device should not be substituted in an application requiring industrial temperature operation. Always verify against the manufacturer's datasheet and the system's thermal requirements before substituting.
What configuration method do the 10M40DCF672C8G and 10M40DAF672C8G use?
Both devices are MAX 10 FPGAs featuring integrated non-volatile flash configuration memory. They support instant-on operation and do not require an external configuration device for basic operation. They also support dual configuration images and can be reconfigured via external sources if required by the design.
Do the 10M40DCF672C8G and 10M40DAF672C8G support embedded memory and DSP functions?
Yes. Both devices include embedded M9K memory blocks and embedded multiplier blocks (DSP blocks) as part of the MAX 10 10M40 density feature set. The exact quantities of M9K blocks and multiplier blocks are defined in the Intel MAX 10 device datasheet for the 10M40 density grade.
What package type do the 10M40DCF672C8G and 10M40DAF672C8G use?
Both devices are supplied in a 672-pin FineLine BGA (FBGA) package, designated by the "F672" code in the ordering part number. This package is lead-free and RoHS-compliant as specified in Intel's product documentation.
Where can verified technical specifications for the 10M40DCF672C8G and 10M40DAF672C8G be found?
Verified specifications are available from the Intel MAX 10 FPGA device datasheet and family documentation, as well as authorized distributor listings such as DigiKey, Mouser, and TTI. These sources provide the ordering code breakdown, temperature grades, package details, and electrical characteristics for both devices.