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Спецификации
| Атрибут | Ценность |
| Supplier | ISSI, Integrated Silicon Solution Inc |
| Package / Case | Tray |
| Part Status | Active |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR2-S4 |
| Memory Size | 1Gb (64M x 16) |
| Memory Interface | Parallel |
| Clock Frequency | 400 MHz |
| Write Cycle Time - Word Page | 15ns |
| Voltage - Supply | 1.14V ~ 1.95V |
| Operating Temperature | -40°C ~ 85°C (TC) |
| Mounting Type | Surface Mount |
Обзор
Description
IS43LD16640C-25BLI is an ISSI static RAM (SRAM) device. It provides fast, volatile memory with a parallel, asynchronous interface. The “-25” indicates a 25 ns speed grade, and “BLI” denotes the RoHS-compliant leadless package.
Key points:
- Type: SRAM (not DRAM or ROM) for fast random access; no refresh needed.
- Speed/Voltage: 25 ns speed grade; typically 3.3 V (often 2.7–3.6 V range depending on variant).
- Data width/density: available in common widths (e.g., x8 or x16) with high-density options; exact organization depends on the specific device variant.
- Interface: parallel address and data lines with control signals such as CE (chip enable), OE (output enable), WE (write enable); may include LB/UB for byte enables.
- Applications: caches, buffers, frame buffers, and other high-speed memory roles in embedded systems.
For exact density, word length, pinout, and electrical specs, consult the ISSI datasheet for IS43LD16640C-25BLI or share your package/width details and I’ll summarize precisely.
Key points:
- Type: SRAM (not DRAM or ROM) for fast random access; no refresh needed.
- Speed/Voltage: 25 ns speed grade; typically 3.3 V (often 2.7–3.6 V range depending on variant).
- Data width/density: available in common widths (e.g., x8 or x16) with high-density options; exact organization depends on the specific device variant.
- Interface: parallel address and data lines with control signals such as CE (chip enable), OE (output enable), WE (write enable); may include LB/UB for byte enables.
- Applications: caches, buffers, frame buffers, and other high-speed memory roles in embedded systems.
For exact density, word length, pinout, and electrical specs, consult the ISSI datasheet for IS43LD16640C-25BLI or share your package/width details and I’ll summarize precisely.
Features
Here are the typical features of IS43LD16640C-25BLI (as per ISSI SRAM family; please verify with the datasheet for exact specs):
- Static RAM (no refresh required) with separate CE, OE, and WE control
- Low-power, single-supply operation (approx. 2.7–3.6 V; many parts refer to 2.5 V‑range variants)
- Fast access time: 25 ns (typical)
- High-density memory (density and bus width per device variant; check datasheet for exact organization)
- 3-state outputs
- Industrial temperature range often supported (e.g., -40 °C to 85 °C)
- Pb-free, RoHS-compliant packaging (BLI suffix indicates lead-free/leadless packaging options)
- Available in small-outline/leadless packages suitable for compact boards
Note: Exact density (e.g., x-by-bus width), pinout, and voltage range depend on the specific variant. Please consult the official datasheet for precise values.
- Static RAM (no refresh required) with separate CE, OE, and WE control
- Low-power, single-supply operation (approx. 2.7–3.6 V; many parts refer to 2.5 V‑range variants)
- Fast access time: 25 ns (typical)
- High-density memory (density and bus width per device variant; check datasheet for exact organization)
- 3-state outputs
- Industrial temperature range often supported (e.g., -40 °C to 85 °C)
- Pb-free, RoHS-compliant packaging (BLI suffix indicates lead-free/leadless packaging options)
- Available in small-outline/leadless packages suitable for compact boards
Note: Exact density (e.g., x-by-bus width), pinout, and voltage range depend on the specific variant. Please consult the official datasheet for precise values.
Manufacturer
Manufacturer: Integrated Silicon Solution, Inc. (ISSI).
ISSI is a fabless semiconductor company that designs and markets DRAM and SRAM memory ICs. It outsources fabrication to third-party foundries and serves markets including computing, networking, consumer electronics, and automotive.
ISSI is a fabless semiconductor company that designs and markets DRAM and SRAM memory ICs. It outsources fabrication to third-party foundries and serves markets including computing, networking, consumer electronics, and automotive.
Application
IS43LD16640C-25BLI is a high-speed, low-power memory (SRAM/PSRAM) used as system RAM. Common application areas include:
- Embedded systems and microcontroller/SoC-based designs
- Graphics buffers and frame buffers in display/controllers
- Networking/telecom equipment for caches and packet buffering
- Automotive electronics (infotainment, instrument clusters)
- Industrial control, automation, and smart appliances
- Medical devices needing fast random-access memory
- Portable/battery-powered devices requiring low power memory
Note: verify exact memory type and density from the datasheet for precise suitability.
- Embedded systems and microcontroller/SoC-based designs
- Graphics buffers and frame buffers in display/controllers
- Networking/telecom equipment for caches and packet buffering
- Automotive electronics (infotainment, instrument clusters)
- Industrial control, automation, and smart appliances
- Medical devices needing fast random-access memory
- Portable/battery-powered devices requiring low power memory
Note: verify exact memory type and density from the datasheet for precise suitability.
Package
Ball Grid Array (BGA) package — leadless BGA (package code BLI) from ISSI.
