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KLM8G1GEME-B041
+БОМBGA Memory (ICs) RoHS
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ПроизводительSamsung
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Мфр. Часть #KLM8G1GEME-B041
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В наличии11766
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Packaging | BGA |
Обзор
Description
- Capacity: 32GB
- Interface: eMMC 5.1 (backward compatible)
- Performance: Sequential read speeds up to 250MB/s, write speeds up to 125MB/s
- Applications: Smartphones, tablets, IoT devices, and industrial embedded systems
- Reliability: Supports wear-leveling, bad block management, and error correction
This NAND flash solution integrates a controller, simplifying integration for OEMs. It operates at 1.8V/3.3V and is offered in a BGA package. Ideal for cost-effective, high-density storage in compact devices.
Equivalent
- KLM8G1GETF-B041 (Samsung, same specs)
- THGBMAG8B4JBAIR (Toshiba, 8GB eMMC)
- MTFC8GAKAJCN-4M IT (Micron, 8GB eMMC)
- SDIN8DE4-8G (Western Digital/SanDisk, 8GB eMMC)
Ensure compatibility with pinout, voltage (3.3V), and interface (eMMC 5.1) when replacing.
Features
- Capacity: 16GB (8Gb x 16)
- Interface: eMMC 5.1 (backward compatible)
- Performance: Up to 400MB/s sequential read, 150MB/s write
- Reliability: Supports wear leveling, bad block management, and ECC
- Operating Voltage: 2.7–3.6V (NAND), 1.7–1.95V (controller)
- Temperature Range: -25°C to +85°C
- Package: 153-ball FBGA (11.5mm x 13mm)
- Endurance: High-performance for embedded applications
Ideal for smartphones, tablets, IoT, and industrial devices.
Pinout
Pin Count: 153 balls
Function: It provides embedded flash storage with an MMC interface, typically used in mobile devices, IoT, and embedded systems. Key features include:
- Capacity: 8GB
- Interface: eMMC 5.1 (backward compatible)
- Data Transfer: Up to 400MB/s (HS400 mode)
- Voltage: 3.3V/1.8V dual-voltage support
Pins include power (VCC, VCCQ), ground (VSS), data (DAT0-DAT7), clock (CLK), command (CMD), and reset (RST_n).
Manufacturer
SK Hynix is a major global producer of memory chips, specializing in DRAM, NAND flash, and other semiconductor solutions. It is one of the largest memory suppliers worldwide, competing with companies like Samsung and Micron. The company serves industries such as consumer electronics, data storage, and enterprise computing.
The KLM8G1GEME-B041 is an older 8GB (1Gx8) MLC NAND chip, commonly used in USB drives, SSDs, and embedded storage devices. SK Hynix is known for its innovation in memory technology and high-volume production.
Application
- Smartphones & Tablets: Storage for apps, media, and OS.
- SSDs & USB Drives: High-speed data storage solutions.
- IoT Devices: Low-power, reliable memory for smart devices.
- Automotive Systems: Infotainment and firmware storage.
- Industrial Equipment: Robust storage for embedded applications.
Its high density (8Gb) and performance make it suitable for compact, high-demand environments.
Package
Frequently Asked Questions
Q: What is the packaging type for the KLM8G1GEME-B041?
A: It is supplied in BGA (Ball Grid Array) packaging, which supports high-density surface mounting for compact designs.
Q: Is this component suitable for embedded storage applications?
A: Yes, the BGA package and Samsung’s NAND technology make it ideal for embedded storage, such as in SSDs or mobile devices.
Q: What is the typical operating temperature range for this part?
A: Specific temperature range is not provided; please refer to the official Samsung datasheet for exact specifications.
Q: Can this component be used in automotive designs?
A: Without explicit automotive-grade certification (e.g., AEC-Q100), it is not recommended for automotive use without further verification.
Q: Does the KLM8G1GEME-B041 support high-speed data transfer?
A: As a Samsung memory component in BGA, it is designed for efficient data throughput, but exact speeds depend on the interface standard (e.g., eMMC or UFS).
