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MT29F1G08ABAEAH4:E
+БОМIC FLASH 1GBIT PARALLEL 63VFBGA
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ПроизводительКомпания Micron Technology Inc.
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Мфр. Часть #MT29F1G08ABAEAH4:E
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В наличии2382
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Obsolete |
| Base Product Number | MT29F1G08 |
| DigiKey Programmable | Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND |
| Memory Size | 1Gbit |
| Memory Organization | 128M x 8 |
| Memory Interface | Parallel |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 63-VFBGA |
| Supplier Device Package | 63-VFBGA (9x11) |
| Packaging | Bulk |
Обзор
Description
The chip features a standard 8-bit interface and operates on a single 3.3V power supply, making it suitable for various environments. It is designed for high endurance and often used in products requiring frequent write and erase cycles. The NAND architecture allows for higher density storage compared to NOR Flash, which is ideal for storing large amounts of data.
Micron’s NAND Flash technology focuses on durability, speed, and efficiency, ensuring data integrity and long lifespan. The MT29F1G08ABAEAH4:E chip typically supports advanced features like Error Correction Code (ECC) and wear leveling to enhance data reliability and longevity.
Equivalent
1. Samsung: K9F1G08U0D, a 1Gb SLC NAND Flash.
2. Toshiba/Kioxia: TC58NVG0S3HBAI4, a 1Gb SLC NAND Flash.
3. SK Hynix: H27U1G8F2BTR, a 1Gb SLC NAND Flash.
These chips typically have similar specifications and can be used interchangeably in applications requiring 1Gb NAND Flash. Always verify compatibility with your specific application requirements.
Features
1. Capacity: 1 Gigabit (128 Megabytes).
2. Interface: 8-bit NAND interface.
3. Architecture: Single-level cell (SLC) technology, providing faster read and write speeds, greater endurance, and improved reliability compared to multi-level cell architectures.
4. Package Type: Available in a TSOP (Thin Small Outline Package) for easy integration into various electronic devices.
5. Performance: Offers high-speed data transfer capabilities with typical read and write operations.
6. Endurance: High endurance suitable for applications requiring frequent write/erase cycles.
7. Operating Voltage: Typically operates at a voltage range around 3.3V, common for NAND flash technologies.
8. Temperature Range: Designed to operate over a wide temperature range, accommodating various environmental conditions.
9. Applications: Suitable for use in consumer electronics, industrial applications, and embedded systems due to its robust performance and reliability.
These features make it a versatile choice for data storage solutions in numerous applications.
Pinout
Key functions of the MT29F1G08ABAEAH4:E include:
1. Data Storage: It allows for the storage of data in a non-volatile manner, meaning data is retained even when the power is turned off.
2. Read/Write Operations: The chip supports basic read and write operations, enabling data to be stored and retrieved as needed.
3. High Density: As a 1Gb NAND Flash memory, it offers a substantial amount of storage capacity for various applications.
4. Interface Compatibility: It uses a standard NAND interface, making it compatible with a wide range of controllers and systems.
This type of NAND Flash memory is typically used in applications like USB drives, memory cards, and solid-state drives (SSDs).
Manufacturer
Application
1. Consumer Electronics: Used in devices like smartphones, tablets, and digital cameras for data storage.
2. Industrial Applications: Employed in machinery and equipment requiring robust data storage solutions.
3. Automotive Systems: Utilized in infotainment systems and navigation units.
4. Computing: Integrated into SSDs and other storage devices in computers and data centers for enhanced performance.
5. Embedded Systems: Incorporated in IoT devices and other embedded applications for efficient data management.
These areas demand efficient data storage solutions with high endurance and reliability, which NAND Flash memory chips like this provide.
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the MT29F1G08ABAEAH4:E?
A: It is a 1Gbit NAND Flash memory organized as 128M x 8 bits, suitable for high-density data storage applications.
Q: What is the operating voltage range for this component?
A: It operates within a supply voltage range of 2.7V to 3.6V, making it compatible with common 3.3V logic systems.
Q: Which memory interface does this NAND Flash chip use?
A: It uses a parallel memory interface, which is standard for NAND Flash devices and enables high-speed data transfers.
Q: What is the operating temperature range for this device?
A: It is rated for commercial temperature operation from 0°C to 70°C (TA), suitable for typical consumer and industrial environments.
Q: What package type is available for this NAND Flash?
A: It comes in a 63-ball VFBGA package (9x11mm), designed for surface mount assembly and space-constrained PCB layouts.
Q: Is this component programmable or verified for current designs?
A: Yes, it is DigiKey Programmable Verified, but note its Part Status is marked as Obsolete, so it is not recommended for new designs.
Q: What is the memory technology used in this part?
A: It utilizes FLASH - NAND technology, which provides non-volatile storage with high density and fast write/erase performance.