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MT40A512M16TD-062E:R
+БОМDDR4 (MICRON)
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ПроизводительКомпания Alliance Memory, Inc.
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Мфр. Часть #MT40A512M16TD-062E:R
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Лист данных MT40A512M16TD-062E:R DataSheet
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В наличии8208
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
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Спецификации
| Атрибут | Ценность |
| Part Status | Active |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR4 |
| Memory Size | 8Gbit |
| Memory Organization | 512M x 16 |
| Clock Frequency | 1.6 GHz |
| Operating Temperature | 0°C ~ 95°C |
| Mounting Type | Surface Mount |
| Package | 96-TFBGA |
| Supplier Device Package | 96-FBGA (7.5x13) |
| Packaging | Tray |
Обзор
Description
Key specifications include:
- Density: 8Gb (Gigabits) per chip, with a total of 512MB (Megabytes) per module.
- Configuration: 16-bit wide data bus.
- Operating Voltage: Typically operates at 1.2V, providing energy efficiency compared to previous generations.
- Speed: Supports data rates up to 2400 MT/s (Mega Transfers per second), enhancing overall system performance.
- Package Type: Available in a standard BGA (Ball Grid Array) form factor for easy integration into circuit boards.
This memory module is suitable for a variety of applications, including servers, desktops, and laptops, where high-performance memory is required.
Equivalent
1. Hynix H5TQ2G83AFR - DDR3 4Gb
2. Samsung K4B4G0846B-HCH9 - DDR3 4Gb
3. Micron MT41K256M16HA-125 - DDR3 4Gb
Ensure compatibility with your specific application or device before substitution.
Features
1. Density: 512Mb memory capacity.
2. Organization: Configured as 16 bits x 32 (16x32) memory array.
3. Speed: Operates at a data rate of up to 1600 MT/s (megatransfers per second).
4. Voltage: Requires a supply voltage of 1.5V, with options for low-voltage operation (1.35V).
5. Package: Available in a 78-ball FBGA (Fine Ball Grid Array) package.
6. Temperature Range: Typically supports commercial temperature range (-40°C to +95°C).
7. Features: Includes features such as on-die termination (ODT) and a 2N prefetch architecture for improved performance.
8. Applications: Suitable for applications in consumer electronics, networking, and computing devices.
This chip is designed for high-performance applications requiring efficient data handling and reliability.
Pinout
The primary functions of the pins include power supply, ground, data input/output, clock signals, and control signals. Key pin functions include:
- DQ0-DQ15: Data input/output pins for 16-bit data.
- A0-A12: Address pins for selecting memory locations.
- BA0-BA1: Bank address pins to select memory banks.
- CS: Chip select signal for activating the chip.
- WE: Write enable signal for write operations.
- CAS: Column address strobe for read operations.
- RAS: Row address strobe for row access.
- CLK: Clock input for synchronization.
- VDD/VSS: Power supply and ground connections.
Overall, this DRAM chip is designed for high-performance memory applications in various electronic devices.
Manufacturer
Application
1. Consumer Electronics: TVs, gaming consoles, and portable devices.
2. Computers: Laptops and desktops for memory expansion.
3. Networking Equipment: Routers and switches for data buffering.
4. Industrial Applications: For embedded systems and automation.
5. Telecommunications: Base stations and infrastructure for data handling.
Its high-density and performance characteristics make it suitable for applications requiring efficient data processing and storage.
Package
Frequently Asked Questions
Q: What is the memory density and organization of the MT40A512M16TD-062E:R?
A: It is an 8Gbit DDR4 SDRAM organized as 512M x 16, providing high-density volatile storage for demanding applications.
Q: What is the maximum clock frequency supported by this DRAM?
A: It supports a clock frequency of 1.6 GHz, enabling high-speed data transfer suitable for DDR4-3200 operation.
Q: What is the operating temperature range for this component?
A: The operating temperature range is 0°C to 95°C, making it suitable for standard commercial and industrial environments.
Q: What package type does the MT40A512M16TD-062E:R use?
A: It comes in a 96-TFBGA package (96-FBGA with dimensions of 7.5x13 mm), designed for surface mount assembly.
Q: Is this memory component volatile or non-volatile?
A: It is volatile memory (DRAM), meaning data is lost when power is removed, and it requires periodic refreshing.
Q: What applications is this DDR4 SDRAM best suited for?
A: It is ideal for servers, networking, telecommunications, and high-performance computing where high bandwidth and reliability are critical.