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MT61K512M32KPA-24:U
+БОМIC DRAM 16GBIT POD 180FBGA
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ПроизводительКомпания Micron Technology Inc.
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Мфр. Часть #MT61K512M32KPA-24:U
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В наличии12378
365 Дни гарантии качества
7*24 часы обслуживания каранти
90-гарантия послепродажного дня
Гарантия подлинного продукта
Спецификации
| Атрибут | Ценность |
| Part Status | Obsolete |
| Base Product Number | MT61K512 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SGRAM - GDDR6 |
| Memory Size | 16Gbit |
| Memory Organization | 512M x 32 |
| Memory Interface | POD_135 |
| Clock Frequency | 12 GHz |
| Voltage - Supply | 1.3095V ~ 1.3905V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package | 180-TFBGA |
| Supplier Device Package | 180-FBGA (12x14) |
| Packaging | Box |
Обзор
Description
Equivalent
Features
1. Memory Capacity: It offers a large capacity of 16 Gb, supporting extensive data storage needs.
2. Speed: The chip operates at a fast data rate, ideal for applications requiring quick data access and processing.
3. Voltage: It functions efficiently at a low operating voltage, enhancing power efficiency and reducing heat generation.
4. Interface: Designed with a parallel interface, it ensures compatibility with a wide range of buses and systems.
5. Temperature Range: It supports a wide operating temperature range, making it suitable for various environments.
6. Reliability: Built for robust performance, it is engineered to deliver reliable operation over extended periods.
7. Package Type: The chip is available in a compact package, facilitating easy integration into devices with space constraints.
These features make the MT61K512M32KPA-24:U suitable for use in computing, consumer electronics, and telecommunications where high-speed and reliable memory is essential.
Pinout
The primary function of this chip is to provide high-speed, low-power memory for applications such as mobile devices, tablets, and other portable electronics. It supports a 32-bit interface and operates at a data rate of up to 4267 MT/s (Mega Transfers per second), which allows for efficient handling of multiple data streams and high-bandwidth operations.
The pinout of this memory chip includes power supply pins, ground pins, data bus pins, address and command pins, and control pins for operations such as clock, reset, and power management. These features enable the MT61K512M32KPA-24:U to deliver optimal performance and power efficiency in compact form factors.
Manufacturer
Application
1. Data Centers: Used in servers and high-performance computing systems for efficient data processing and storage.
2. Networking Equipment: Utilized in routers and switches for fast data transmission and buffering.
3. Telecommunications: Supports infrastructure requiring rapid data access and processing.
4. Consumer Electronics: Powers high-speed applications in gaming consoles and advanced computing devices.
5. Enterprise Systems: Enhances performance in storage systems and enterprise-level applications.
6. Automotive Systems: Provides memory solutions for infotainment systems, ADAS, and other automotive applications.
Package
Frequently Asked Questions
Q: What is the memory capacity and organization of the MT61K512M32KPA-24:U?
A: This part is a 16Gbit GDDR6 SGRAM organized as 512M x 32 bits, delivering high bandwidth for graphics and compute applications.
Q: What is the maximum clock frequency and interface standard supported?
A: It supports a clock frequency of 12 GHz (GDDR6 data rate) and uses a POD_135 memory interface for high-speed signaling.
Q: What voltage supply range does this GDDR6 memory require?
A: Operating voltage is 1.3095V to 1.3905V, typical for GDDR6 designs, requiring precise power regulation.
Q: Is this component still in active production or obsolete for new designs?
A: The part status is listed as “Obsolete,” so it is not recommended for new designs; verify availability for legacy repairs.
Q: What is the operating temperature range for this memory component?
A: It operates from 0°C to 95°C (case temperature), suitable for high-performance computing environments with proper thermal management.
Q: What package type and dimensions does the MT61K512M32KPA-24:U use?
A: It comes in a 180-ball TFBGA package, with supplier device package dimensions of 12x14 mm (180-FBGA).
Q: Can this GDDR6 memory be used in standard graphics cards or AI accelerators?
A: Yes, its 512M x 32 organization and 12 GHz speed make it ideal for high-bandwidth applications like gaming GPUs and AI inference modules.