BCM88470CB0KFSBG

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BCM88470CB0KFSBG

+БОМ

300 GBE CENTRALIZED SWITH

  • Производителькомпанией Broadcom Limited

  • Мфр. Часть #BCM88470CB0KFSBG

  • Пакет BGA-1365

  • В наличии5118

365 Дни гарантии качества

7*24 часы обслуживания каранти

90-гарантия послепродажного дня

Гарантия подлинного продукта

Спецификации

Атрибут Ценность
Package / Case Tray
Part Status Active
Protocol Ethernet
Function Switch
Interface Ethernet

Обзор

Description

The BCM88470CB0KFSBG is a model of a high-performance network switch integrated circuit (IC) produced by Broadcom. It is part of the StrataDNX family, designed for high-capacity, flexible, and efficient data center and service provider networks. This IC supports advanced features like high-density switching, deep packet buffering, and extensive QoS capabilities, making it suitable for large-scale network infrastructures. The chip is engineered to handle a vast amount of network traffic with minimal latency, ensuring smooth and reliable data flow.
The BCM88470CB0KFSBG incorporates advanced hardware-based forwarding and packet processing abilities, supporting a wide range of networking protocols and standards. It is designed to deliver high throughput and scalability, addressing the growing demand for bandwidth and network complexity. With enhanced programmability, this switch IC can be adapted to various network configurations and requirements, ensuring future-proof network deployments. Its compact design and integration of multiple functions into a single chip help reduce the overall cost and power consumption of network equipment.

Equivalent

The BCM88470CB0KFSBG chip is part of Broadcom's StrataDNX series, often used for high-performance networking. Equivalent products would generally come from competitors like Cisco, Marvell, and Intel. Specifically, you might consider Marvell's Prestera series or similar high-throughput switch chips from Intel's Tofino series. These alternatives offer comparable features in terms of throughput, port density, and networking capabilities. Always compare specific features and requirements to ensure compatibility and performance matching.

Features

The BCM88470CB0KFSBG is a high-performance Ethernet switch chip designed by Broadcom. Key features include:
1. High Port Density: Supports multiple 10G, 25G, 40G, 50G, and 100G Ethernet ports, making it suitable for data center and enterprise networking applications.
2. Advanced Switching Capabilities: Offers high-throughput switching with deep buffering capabilities for optimal performance in high-traffic environments.
3. Scalability: Designed to support large-scale network deployments with flexible port configurations and advanced load balancing.
4. Programmability: Supports programmable forwarding pipelines, enabling customization and optimization for specific network requirements.
5. Low Latency: Provides low-latency packet processing, essential for high-speed data center applications.
6. Enhanced Security: Includes features for enhanced security, such as support for advanced encryption standards and secure boot mechanisms.
7. Energy Efficient: Designed with power-saving technologies to reduce operational costs while maintaining high performance.
These features make the BCM88470CB0KFSBG a versatile and powerful choice for modern networking solutions.

Pinout

The BCM88470CB0KFSBG is a networking chip produced by Broadcom, typically used in high-performance networking equipment. However, specific details such as pin count and function are proprietary and not publicly detailed in standard datasheets. This chip is part of Broadcom's StrataDNX family, designed for high-capacity data center and carrier networks, focusing on efficient packet processing, switching, and routing.
For precise information regarding pin count and specific functions, access to Broadcom's technical documents, such as a detailed datasheet or a product brief, would be necessary. These documents are typically available to Broadcom's customers or partners under a non-disclosure agreement (NDA) due to the proprietary nature of the technology. For general inquiries, visiting Broadcom's official website or contacting their support team might provide further assistance.

Manufacturer

The BCM88470CB0KFSBG is manufactured by Broadcom Inc. Broadcom is a global technology company that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions. The company's products are used across various industries, including data center, networking, broadband, wireless, and industrial markets. Broadcom is known for its innovations in fields such as wired and wireless communication, enterprise software, storage, and industrial solutions.

Application

The BCM88470CB0KFSBG is a highly integrated network switch chip designed for use in high-performance data centers and enterprise networks. Its primary application areas include:
1. Data Center Networks: Facilitates high-speed data transfer and efficient network management.
2. Enterprise Networking: Provides robust connectivity solutions for large organizations.
3. Telecommunications Infrastructure: Supports high-capacity and reliable telecom networks.
4. Cloud Computing Environments: Enhances connectivity and data processing for cloud services.
5. Network Security Appliances: Ensures secure data transmission and network protection.
These applications leverage the chip’s advanced switching capabilities, scalability, and support for high-bandwidth operations.

Package

The BCM88470CB0KFSBG is a Broadcom switch chipset, typically used in networking applications. The package type for this model is a ball grid array (BGA), designated by the suffix "KFSBG." This type of packaging allows for high-density connections and is commonly used in complex integrated circuits.

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