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PIC18LF26K22T-E/MLV01
+БОМ8-bit Microcontrollers - MCU
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ПроизводительТехнология микрочипов
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Мфр. Часть #PIC18LF26K22T-E/MLV01
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Лист данных PIC18LF26K22T-E/MLV01 DataSheet
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В наличии12334
365 Дни гарантии качества
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Спецификации
| Атрибут | Ценность |
Обзор
Description
- Architecture: 8-bit RISC with 16 MIPS performance at 64 MHz.
- Memory: 64 KB Flash, 3.8 KB RAM, 1 KB EEPROM.
- Voltage Range: 1.8V–5.5V (low-power operation).
- Peripherals: 12-bit ADC, PWM, USART, SPI, I²C, timers, and comparators.
- Package: 28-pin QFN (5x5 mm), suitable for compact designs.
- Temperature Range: -40°C to +125°C (extended industrial).
Ideal for battery-powered, industrial, and embedded applications requiring efficiency and reliability. Offers nanoWatt XLP for ultra-low power consumption in sleep modes.
For detailed specs, refer to the [Microchip datasheet](https://www.microchip.com).
Features
- Core: 16 MIPS @ 32 MHz (PIC18 enhanced architecture).
- Memory: 64 KB Flash, 3.8 KB RAM, 1 KB EEPROM.
- Voltage Range: 1.8V–5.5V (low-power operation).
- Peripherals:
- 12-bit ADC (up to 24 channels).
- 3x PWM, 2x ECCP (Enhanced CCP).
- 2x UART, SPI, I²C.
- 2x Comparators, 1x Op-Amp.
- Low Power: NanoWatt XLP tech (100 nA sleep current).
- Packaging: 28-pin QFN (5x5 mm).
- Temp Range: -40°C to +85°C.
Ideal for battery-powered and embedded applications.
Pinout
- CPU: 16-bit architecture, up to 64 MHz operation.
- Memory: 64 KB Flash, 3.8 KB RAM, 1 KB EEPROM.
- I/O: 25 programmable pins (multiplexed with peripherals).
- Peripherals:
- Analog: 10-bit ADC (13 channels), comparators.
- Communication: UART, SPI, I²C (MSSP).
- Timers: 4x 8/16-bit timers, PWM.
- Power: Low-voltage operation (1.8V–3.6V), nanoWatt XLP for ultra-low power.
Pins support digital I/O, analog input, interrupts, and peripheral functions. Exact pin functions depend on configuration.
Manufacturer
Application
- Consumer Electronics (remote controls, smart home devices)
- Industrial Automation (sensors, motor control, PLCs)
- Medical Devices (portable diagnostics, monitoring systems)
- Automotive (accessory control, lighting systems)
- IoT & Embedded Systems (battery-powered wireless nodes)
Its features (low power, USB, ADC, PWM) make it suitable for cost-sensitive, power-efficient designs.
Package
This surface-mount package is compact, lead-free, and suitable for high-density PCB designs. It offers good thermal and electrical performance, making it ideal for embedded applications. The "ML" suffix denotes the QFN package type.